Energy conditioning circuit arrangement for integrated circuit

ABSTRACT

The present invention relates to an interposer substrate for interconnecting between active electronic componentry such as but not limited to a single or multiple integrated circuit chips in either a single or a combination and elements that could comprise of a mounting substrate, substrate module, a printed circuit board, integrated circuit chips or other substrates containing conductive energy pathways that service an energy utilizing load and leading to and from an energy source. The interposer will also possess a multi-layer, universal multi-functional, common conductive shield structure with conductive pathways for energy and EMI conditioning and protection that also comprise a commonly shared and centrally positioned conductive pathway or electrode of the structure that can simultaneously shield and allow smooth energy interaction between grouped and energized conductive pathway electrodes containing a circuit architecture for energy conditioning as it relates to integrated circuit device packaging. The invention can be employed between an active electronic component and a multilayer circuit card. A method for making the interposer is not presented and can be varied to the individual or proprietary construction methodologies that exist or will be developed.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of application Ser. No. 12/017,020,filed Jan. 19, 2008, now issued as U.S. Pat. No. 7,609,501, which is acontinuation of application Ser. No. 11/828,522, filed Jul. 26, 2007,now issued as U.S. Pat. No. 7,609,500, which is a continuation ofapplication Ser. No. 11/169,926, filed Jun. 30, 2005, now U.S. Pat. No.7,301,748, which is a continuation of application Ser. No. 10/237,079,filed Sep. 9, 2002, now issued as U.S. Pat. No. 7,110,227, which is acontinuation-in-part of application Ser. No. 09/632,048, filed Aug. 3,2000, now issued as U.S. Pat. No. 6,738,249, which is acontinuation-in-part of application Ser. No. 09/594,447, filed Jun. 15,2000, now issued as U.S. Pat. No. 6,636,406, which is acontinuation-in-part of application Ser. No. 09/579,606, filed May 26,2000, now issued as U.S. Pat. No. 6,373,673, which is acontinuation-in-part of application Ser. No. 09/460,218, filed Dec. 13,1999, now issued as U.S. Pat. No. 6,331,926, which is a continuation ofapplication Ser. No. 09/056,379, filed Apr. 7, 1998, now issued as U.S.Pat. No. 6,018,448, which is a continuation-in-part of application Ser.No. 09/008,769, filed Jan. 19, 1998, now issued as U.S. Pat. No.6,097,581, which is a continuation-in-part of application Ser. No.08/841,940, filed Apr. 8, 1997, now issued as U.S. Pat. No. 5,909,350;

and this application is a continuation of application Ser. No.12/017,020, filed Jan. 19, 2008, now issued as U.S. Pat. No. 7,609,501,which is a continuation of application Ser. No. 11/828,522, filed Jul.26, 2007, now issued as U.S. Pat. No. 7,609,500, which is a continuationof application Ser. No. 11/169,926, filed Jun. 30, 2005, now U.S. Pat.No. 7,301,748, which is a continuation of application Ser. No.10/237,079, filed Sep. 9, 2002, now issued as U.S. Pat. No. 7,110,227,which is a continuation-in-part of application Ser. No. 09/632,048,filed Aug. 3, 2000, now issued as U.S. Pat. No. 6,738,249, which is acontinuation-in-part of application Ser. No. 09/600,530, filed Jul. 18,2000, now issued as U.S. Pat. No. 6,498,710, which was the NationalStage of International Application No. PCT/US99/01040, filed Jan. 16,1999;

and U.S. Pat. No. 6,738,249 claims the benefit of provisionalApplication No. 60/146,987, filed Aug. 3, 1999, provisional applicationNo. 60/165,035, filed Nov. 12, 1999, provisional application No.60/180,101, filed Feb. 3, 2000, provisional Application No. 60/185,320,filed Feb. 28, 2000, provisional Application No. 60/191,196, filed Mar.22, 2000, provisional Application No. 60/200,327, filed Apr. 28, 2000,provisional Application No. 60/203,863, filed May 12, 2000, provisionalApplication No. 60/215,314, filed Jun. 30, 2000;

and U.S. Pat. No. 6,636,406 claims the benefit of provisionalApplication No. 60/146,987, filed Aug. 3, 1999, provisional ApplicationNo. 60/165,035, filed Nov. 12, 1999, provisional Application No.60/180,101, filed Feb. 3, 2000, provisional Application No. 60/185,320,filed Feb. 28, 2000, provisional Application No. 60/191,196, filed Mar.22, 2000, provisional Application No. 60/200,327, filed Apr. 28, 2000,provisional Application No. 60/203,863, filed May 12, 2000;

and U.S. Pat. No. 6,373,673 claims the benefit of provisionalApplication No. 60/136,451, filed May 28, 1999, provisional ApplicationNo. 60/139,182, filed Jun. 15, 1999, provisional Application No.60/146,987, filed Aug. 3, 1999, provisional Application No. 60/165,035,filed Nov. 12, 1999, provisional Application No. 60/180,101, filed Feb.3, 2000, provisional Application No. 60/185,320, filed Feb. 28, 2000,provisional Application No. 60/200,327, filed Apr. 28, 2000, provisionalApplication No. 60/203,863, filed May 12, 2000.

This application incorporates by reference all of the followingapplications, including specification, claims, and figures:

application Ser. No. 12/017,020, filed Jan. 19, 2008, now U.S. Pat. No.7,609,501,

application Ser. No. 11/828,522, filed Jul. 26, 2007, now U.S. Pat. No.7,609,500,

application Ser. No. 11/169,926, filed Jun. 30, 2005, now U.S. Pat. No.7,301,748,

application Ser. No. 10/237,079, filed Sep. 9, 2002, now U.S. Pat. No.7,110,227;

and this application also incorporates by reference all of thedisclosure, including the specification, claims, and figures inInternational Application No. PCT/US01/30295, filed Sep. 27, 2001;

and this application incorporates by reference U.S. Pat. No. 6,018,448,filed Apr. 8, 1998, which is a continuation-in-part of application Ser.No. 09/008,769, filed Jan. 19, 1998, now issued as U.S. Pat. No.6,097,581, which is a continuation-in-part of application Ser. No.08/841,940, filed Apr. 8, 1997, now issued as U.S. Pat. No. 5,909,350;

and this application incorporates by reference application Ser. No.09/561,283, filed Apr. 28, 2000, application Ser. No. 09/579,606, filedMay 26, 2000, application Ser. No. 09/594,447, filed Jun. 15, 2000, andprovisional Application No. 60/215,314, filed Jun. 30, 2000.

TECHNICAL FIELD

The present invention relates to a circuit interposer comprising amultilayer, universal, multi-functional, common conductive shieldstructure with conductive pathways for energy and EMI conditioning andprotection that possesses a commonly shared and centrally positionedconductive pathway or electrode that simultaneously shields and allowssmooth energy transfers such as decoupling operations between groupedand energized conductive pathways. The invention is for energyconditioning as it relates to integrated circuit (IC) device packagingor direct mounted IC modules, and more specifically, for interconnectingenergy utilizing integrated circuit chips to a printed circuit board,(IC) device packaging or direct mounted IC modules as a interconnectionmedium between ICs and their component packaging and/or external energycircuit connections or other substrates containing energy pathwaysleading to and from an energy source and an energy utilizing load.

More specifically, the present invention allows paired or neighboringconductive pathways or electrodes to operate with respect to one anotherin a harmonious fashion, yet in an oppositely phased or charged manner,respectively. The invention will provide energy conditioning in suchforms of EMI filtering and surge protection while maintaining apparenteven or balanced voltage supply between a source and an energyutilizing-load when placed into a circuit and energized. The variousembodiments of the invention will also be able to simultaneous andeffectively provide energy conditioning functions that includebypassing, decoupling, energy storage, while maintaining a continuedbalance in SSO (Simultaneous Switching Operations) states withoutcontributing disruptive energy parasitics back into the circuit systemas the invention is passively operated within the circuit.

BACKGROUND OF THE INVENTION

Interposer structures can be used in the manufacturing process of singleand multi-chip modules (SCMs or MCMs) to electrically connect one ormore integrated circuit chips (ICs) to a printed circuit board, discreetIC electronic packaging, or other substrates. The interposer providesconditioning of various forms of energy propagating along the containedinternal interposer conductive pathways located between an energy sourceand an energy-utilizing load such as an IC. The interposer can provideenergy paths between the IC chips and a PC board or substrate, and ifdesired, between different active component chips mounted on theinterposer, itself.

A main disadvantage of conventional approaches to interconnecting andpackaging of IC chips in Multi Chip Modules (MCMs) arises from thethinness of the substrates used in traditional multichip modules resultsin the energy feeds to the IC chips having relatively high impedance.This results in undesired noise, energy loss and excess thermal energyproduction. These problems are relevant and can be critical to systemintegrity when routing or propagating energy along pathways though aninterposer substrate.

Electrical systems have undergone short product life cycles over thelast decade. A system built just two years ago can be consideredobsolete to a third or fourth generation variation of the sameapplication. Accordingly, passive electronic components and thecircuitry built into these the systems need to evolve just as quickly.However, the evolvement of passive electronic componentry has not keptpace. The performance of a computer or other electronic systems hastypically been constrained by the operating frequency of its slowestactive elements. Until recently, those elements were the microprocessorand the memory components that controlled the overall system's specificfunctions and calculations. Nevertheless, with the advent of newgenerations of microprocessors, memory components and their data, thefocus has changed. There is intense pressure upon the industry toprovide the system user with increased processing energy and speed at adecreasing unit cost. EMI created in these environments must also beeliminated or minimized to meet international emission and/orsusceptibility requirements.

Processor operating frequency (speed) is now matched by the developmentand deployment of ultra-fast RAM (Random Access Memory) architectures.These breakthroughs have allowed an increase of the overallsystem—operating frequency (speed) of the active components past the 1GHz mark. During this same period, however, passive componenttechnologies have failed to keep up with these new breakthroughs andhave produced only incremental changes in composition and performance.These advances in passive component design and changes have focusedprimarily upon component size reduction, slight modifications ofdiscrete component electrode layering, dielectric discoveries, andmodifications of device manufacturing techniques or rates of productionthat decrease unit production cycle times.

In addition, at these higher frequencies, energy pathways shouldnormally be grouped or paired as an electrically complementary elementor elements that work together electrically and magnetically in harmonyand in balance within an energized system. Attempts to line conditionpropagating energy with prior art components has led to increased levelsof interference in the form of EMI, RFI, and capacitive and inductiveparasitics. These increases are due in part to manufacturing imbalancesand performance deficiencies of the passive components that create orinduce interference into the associated electrical circuitry.

These problems have created a new industry focus on passive componentswhereas, only a few years ago, the focus was primarily on theinterference created by the active components from sources andconditions such as voltage imbalances located on both sides of a commonreference or ground path, spurious voltage transients from energy surgesor human beings, or other electromagnetic wave generators.

At higher operating speeds, EMI can also be generated from theelectrical circuit pathway itself, which makes shielding from EMIdesirable. Differential and common mode noise energy can be generatedand will traverse along and around cables, circuit board tracks ortraces, and along almost any high-speed transmission line or bus linepathway. In many cases, one or more of these critical energy conductorscan act as an antenna, hence creating energy fields that radiate fromthese conductors and aggravate the problem even more. Other sources ofEMI interference are generated from the active silicon components asthey operate or switch. These problems such as SSO are notorious causesof circuit disruptions. Other problems include unshielded and parasiticenergy that freely couples upon or onto the electrical circuitry andgenerates significant interference at high frequencies.

U.S. patent application Ser. No. 09/561,283 filed on Apr. 28, 2000 andU.S. patent application Ser. No. 09/579,606 filed on May 26, 2000, andU.S. patent application Ser. No. 09/594,447 filed on Jun. 15, 2000 alongwith U.S. Provisional Application No. 60/200,327 filed Apr. 28, 2000,U.S. Provisional Application No. 60/203,863 filed May 12, 2000, and U.S.Provisional Application No. 60/215,314 filed Jun. 30, 2000 by theapplicants relate to continued improvements to a family of discrete,multi-functional energy conditioners. These multi-functional energyconditioners posses a commonly shared, centrally located, conductiveelectrode of a structure that can simultaneously interact with energizedand paired conductive pathway electrodes contained in energy-carryingconductive pathways. These energy-carrying conductive pathways canoperate in an oppositely phased or charged manner with respect to eachother and are separated from one another by a physical shielding.

SUMMARY OF THE INVENTION

Based upon the foregoing, there has been found a need to provide amanufactured interposed circuit connection device that uses a layered,multi-functional, common conductive shield structure containingenergy-conductive pathways that share a common and centrally positionedconductive pathway or electrode as part of its structure which allowsfor energy conditioning as well as a multitude of other functionssimultaneously in one complete unit.

The invention will also comprise at least one inclusive embodiment orembodiment variation that possesses a commonly shared and centrallypositioned conductive pathway or electrode as part of its structure.

The invention will also provide for simultaneous physical and electricalshielding to portions of an active chip structure as well as forinternal propagating energies within the new structure by allowingpredetermined, simultaneous energy interactions to take place betweengrouped and energized conductive pathways to be fed by pathways externalto the embodiment elements.

This application expands upon this concept and further discloses a newcircuit interposer comprising a multilayer, universal multi-functional,common conductive shield structure with conductive pathways thatreplaces multiple, discreet versions of various prior art devices with asingle individual unit that provides a cost effective system of circuitprotection and conditioning that will help solve or reduce industryproblems and obstacles as described above.

Accordingly, the solution to low impedance energy distribution aboveseveral hundred MHz lies in thin dielectric energy plane technology, inaccordance with the present invention, which is much more effective thanmultiple, discrete decoupling capacitors.

It is an object of the invention to be able to provide energy decouplingfor active system loads while simultaneously maintaining a constant,apparent voltage potential for that same portion of active componentsand its circuitry.

It is an object of the invention to minimize or suppress unwantedelectromagnetic emissions resulting from differential and common modecurrents flowing within electronic pathways that come under theinvention influence.

It is an object of the invention to provide a wide variety ofmulti-layered embodiments and utilize a host of dielectric materials,unlimited by their specific physical properties that can, when attachedinto circuitry and energized, provide simultaneous line conditioningfunctions and protections as will be described.

It is an object of the invention to provide the ability to the user tosolve problems or limitations not met with prior art devices whichinclude, but are not limited to, simultaneous source to load and/or loadto source decoupling, differential mode and common mode EMI filtering,containment and exclusion of certain energies such as capacitive andinductive parasitics, as well as parasitic containment and surgeprotection in one integrated embodiment and that performs thesedescribed abilities when utilizing a conductive area or pathway.

It is an object of the invention to be easily adapted to utilizationwith or without, one or more external conductive attachments to aconductive area located external to the originally manufacturedinvention. The external connection to a conductive area—can aid theinvention embodiments in providing protection to electronic systemcircuitry.

It is an object of the invention to provide a physically integrated,shield-containment, conductive electrode architecture for the use withindependent electrode materials and/or an independent dielectricmaterial composition, that when manufactured, will not limit theinvention to a specific form, shape, or size for the multitude ofpossible embodiments of the invention that can be created and is notlimited to embodiments shown herein.

It is another object of the invention to provide a constant apparentvoltage potential for portions of circuitry.

It is another object of the invention to provide an embodiment thatutilizes standard manufacturing processes and be constructed of commonlyfound dielectric and conductive materials or conductively made materialsto reach tight capacitive, inductive and resistive tolerances between oralong electrical pathways within the embodiment, while simultaneouslymaintaining a constant and uninterrupted conductive pathway for energypropagating from a source to an energy utilizing load.

It is another object of this invention to provide a means of loweringcircuit impedance by providing and maintaining conductive pathways thatare essentially in parallel within the interposer to the energy sourceand the energy-utilizing load when attached into circuitry between thesetheir energy conduits and to a circuit reference node or ground as a lowcircuit impedance pathway.

Lastly, it is an object of the invention to provide an embodiment thatcouples pairs or groups of paired electrical pathways or conductors veryclosely in relation to one another into an area or space partiallyenveloped by a plurality of commonly joined conductive electrodes,plates, or pathways, and can provide a user with a choice of selectivelycoupling external conductors or pathways on to separate or commonconductive pathways or electrode plates located within the sameembodiment.

Numerous other arrangements and configurations are also disclosed whichimplement and build upon the above objects and advantages of theinvention in order to demonstrate the versatility arid wide spreadapplication of a universal energy conditioning interposer with circuitarchitecture for energy and EMI conditioning and protection within thescope of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A shows an exploded perspective view of an embodiment from familymulti-functional energy conditioners;

FIG. 1B shows an exploded perspective view of an alternate embodimentfrom the family multi-functional energy conditioners shown in FIG. 1A;

FIG. 2 provides a circuit schematic representation of the physicalarchitecture from FIG. 1A and FIG. 1B when placed into a largerelectrical system and energized;

FIG. 2A shows an exploded perspective view of a portion of the presentinvention comprising an interconnected, parallel, common conductiveshield structure;

FIG. 3 shows a top view of a portion of some of the non-holed embodimentelements comprising a portion of a Faraday cage-like conductive shieldstructure and a by-pass conductive pathway electrode;

FIG. 4 shows an exploded perspective view of a portion the non-holedembodiment elements that form a Faraday cage-like conductive shieldstructure that comprises a non-holed, interconnected, parallel, commonconductive shield structure;

FIG. 4A shows an exploded, perspective view depicting four commonconductive cage-like structure containers as shown in FIG. 2A forcomparison to a nondiscrete universal multi-functional common conductiveshield structure with feed-thru pathways (UMFCCSS-F) shown in FIG. 4B;

FIG. 4B shows an exploded view depicting four common conductivecage-like structure containers with conductive pathways that make up auniversal multi-functional common conductive shield structure withfeed-thru pathways (UMFCCSS-F);

FIG. 4C shows an exploded, perspective view depicting four commonconductive cage-like structure containers shown in. FIG. 2A forcomparison to a nondiscrete universal multi-functional common conductiveshield structure with bypass pathways (UMFCCSS-B) shown in FIG. 4D;

FIG. 4D shows an exploded view depicting four common conductivecage-like structure with common conductive pathway electrode layers likethat shown in FIG. 4C for use as a universal multi-functional commonconductive shield structure with bypass pathways (UMFCCSS-B) when usedas a non-discrete embodiment that can be manufactured into a PCB orsubstrate or a portion of a silicon die such as in a die made into aMPU, DSP or the like (micro processor unit or digital signal processoror any other silicon and/or copper based dice or die);

FIG. 5A shows an exploded cross-section view of a non-holed,multi-layered by-pass arrangement of the circuit architecture used inpresent invention configurations with outer image shields;

FIG. 5B shows a second exploded cross-sectional view of a layeredby-pass as shown in FIG. 5A and rotated 90 degrees there from;

FIG. 6A shows an exploded view of a layered arrangement of an embodimentof the present invention with outer image shields;

FIG. 6B shows a partial view of the interposer arrangement depicted inFIG. 6A mounted above an Integrated Circuit Die placed into a portion ofan Integrated Circuit Package that uses wire leads or pininterconnection instead of ball grid interconnections;

FIG. 7 shows a top view of an interposer arrangement;

FIG. 8A shows a cross-sectional view of an alternate interposerarrangement depicted in FIG. 7;

FIG. 8B shows a partial cross-sectional view of the interposerarrangement depicted in FIG. 7 now mounted in between an IntegratedCircuit Die Integrated Circuit Package with ball grid interconnection isshown;

FIG. 9 shows a close-up view of a solder ball interconnection of FIG.8A;

FIG. 10 shows a partial top external view of an Integrated CircuitPackage showing the outline of a prior art interposer with externallymounted, discrete arrays used to assist energy conditioning;

FIG. 11 shows a partial top external view of an Integrated CircuitPackage similarly depicted in FIG. 10 but with out the prior artinterposer but the new invention placed between an Integrated CircuitDie Integrated Circuit Package with ball grid interconnection is shown;

FIG. 12 shows a multi-filter surface mount component with FIG. 12 abeing a top plan view of the filter;

FIGS. 12 b through 12 d shows top plan views of internal electrodelayers; and

FIG. 12 e shows a front elevational view in cross section of the filtershown in FIG. 12 a.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

As used herein, the acronym terms “UECICA” will be used to mean auniversal energy conditioning interposer with circuit architecture forenergy and EMI conditioning and protection within the scope of thepresent invention and refers to all types of discrete versions of thedevice.

In addition, as used herein, the acronym term “AOC” for the words“predetermined area or space of physical convergence or junction” whichis defined as the physical boundary of manufactured-together inventionelements. Non-energization and energization are defined as the range ordegree to which electrons within the “AOC” of either discrete ornon-discrete versions of UECICA are in motion and are propagating toand/or from an area located outside the pre-determined in a balancedmanner.

U.S. Pat. No. 6,018,448, which is a continuation-in-part of applicationSer. No. 09/008,769 filed Jan. 19, 1998, now issued as U.S. Pat. No.6,097,581, which is a continuation-in-part of application Ser. No.08/841,940 filed Apr. 8, 1997, now issued as U.S. Pat. No. 5,909,350 andU.S. patent application Ser. No. 09/561,283 filed on Apr. 28, 2000, U.S.patent application Ser. No. 09/579,606 filed on May 26, 2000, and U.S.patent application Ser. No. 09/594,447 filed on Jun. 15, 2000 along withU.S. Provisional Application No. 60/215,314 filed Jun. 30, 2000 by theapplicants relate to continued improvements to a family of discrete,multi-functional energy conditioners and multi-functional energyconditioning shield structures and are incorporated by reference,herein.

The new UECICA begins as a combination of electrically conductive,electrically semi-conductive, and non-conductive dielectric independentmaterials, layered or stacked in various structures. These layers can becombined to form a unique circuit when placed and energized in a system.The invention embodiments can include layers of electrically conductive,electrically semi-conductive, and non-conductive materials that formgroups of common conductive pathway electrodes, differentially phasedconductors, deposits, plates, VIAs, filled and unfilled conductiveapertures that can all be referred to at one time or another, herein asmeaning ‘energy conductive pathway’. Herein, the term “commonconductive”, means the same species of energy pathway that may all bejoined together in one conductive structure as a common energy pathwayof low impedance as opposed to a differential conductive pathway that isusually written as with respect to another pathway that is paired upwith the same in an energized circuit that would have an electricallyopposite pathway functioning electromagnetically, in most cases, 180degrees opposite our out of phase with its counterpart.

Dielectric, non-conductive and semi-conductive mediums or materials canalso be referred to as simply insulators, non-pathways or simplydielectric. Some of these elements are oriented in a generally parallelrelationship with respect to one another and to a predetermined pairingor groups of similar elements that can also include various combinationsof conductive pathways and their layering made into a predetermined ormanufactured structure. Other elements of the invention can be orientedin a generally parallel relationship with respect to one another and yetwill be in a generally perpendicular relationship with other elements ofthe same invention.

Predetermined arrangements are used in manufacturing the invention tocombine many of the elements just described such as dielectric layers,multiple electrode conductive pathways, sheets, laminates, deposits,multiple common conductive pathways, shields, sheets, laminates, ordeposits, together in an interweaved arrangement of overlapping,partially overlapping and non-overlapping positions with respect toother physical structures with in the invention made up identically ofthe same materials yet are effected by a predetermined configurationsequence of the end manufactured result that connects specific types ofthese same elements such as VIAs, dielectric layers, multiple electrodeconductive pathways, sheets, laminates, deposits, multiple commonconductive pathways, shields, sheets, laminates, or deposits, togetherfor final energizing into a larger electrical system in a predeterminedmanner.

Other conductive energy pathways can intersect and pass through thevarious layers just described and can be in a generally non-parallel oreven perpendicular relationship with respect to these same groups oflayers. Conductive and nonconductive spacers can be attached to thevarious groups of layers and intersecting, perpendicular pathways in apredetermined manner that allows various degrees and functions of energyconditioning to occur with portions of propagating energy passing intoand out of the invention AOC.

As for all embodiments of the present invention depicted and those notpictured, the applicants contemplate a manufacturer to have the optionin some cases, for combining a variety and wide range of possiblematerials that are selected and combined into the final make-up of theinvention while still maintaining some or nearly all of the desireddegrees of electrical conditioning functions of the invention after itis manufactured and placed into a circuit and energized. Materials forcomposition of the invention can comprise one or more layers of materialelements compatible with available processing technology and is notlimited to any possible dielectric material. These materials may be asemiconductor material such as silicon, germanium, gallium-arsenide, ora semi-insulating or insulating material and the like such as, but notlimited to any material having a specific dielectric constant, K.

Equally so, the invention is not limited: to any possible conductivematerial such as magnetic, nickel-based materials, MOV-type material,ferrite material; —any substances and processes that can createconductive pathways for a conductive material such as Mylar films orprinted circuit board materials; or any substances or processes that cancreate conductive areas such as, but not limited to, doped polysilicons,sintered polycrystallines, metals, or polysilicon silicates, polysiliconsilicide. When or after the structured layer arrangement is manufacturedas an interposer it is not limited to just IC packages, it can becombined with, shaped, buried within or embedded, enveloped, or insertedinto various electrical packaging, other substrates, boards, electricalarrangements, electrical systems or other electrical sub-systems toperform simultaneous energy conditioning, decoupling, so to aid inmodifying an electrical transmission of energy into a desired electricalform or electrical shape.

An alternative embodiment can serve as a possible system or subsystemelectrical platform that contains both active and passive componentsalong with additional circuitry, layered to provide most of the benefitsdescribed for conditioning propagated energy from a source to a load andback to a return. Some prior art interposers are already utilizingpredetermined layered configurations with VIAs to service or tap thevarious conductive pathways or layers that lie between a dielectric oran insulating material.

The invention will also comprise at least one inclusive embodiment orembodiment variation that possesses a commonly shared and centrallypositioned conductive pathway or electrode as part of its structure.

The invention will also provide for simultaneous physical and electricalshielding to portions an active chip structure as well as for internallypropagating energies within the new structure by allowing predetermined,simultaneous energy interactions to take place between grouped andenergized—conductive pathways to be fed by pathways external to theembodiment elements.

Existing prior art discrete decoupling capacitors lose theireffectiveness at about 500 MHz. For example, mounting inductance for0603 size capacitors has been reduced to approximately 300 pH. Assuming200 pH for the internal capacitance of the capacitors, this equates to atotal of 500 pH, which corresponds to 1.57-Ohms at 500 MHz. Accordingly,current discrete capacitors are not effective. While it is possible touse multiple components that have various values of series resonantfrequencies and low ESR capacitors to drive towards low impedance at 500MHz, the capacitance required to obtain 500 MHz with 500 pH ESL is about200 pF. Current board materials (FR-4, 4 mils dielectric)—get 225 pF forevery square inch of energy planes, which would require more than onediscrete capacitor every square inch. Normally, various interposers thatcontain multiple discrete passive component structures offer into thecircuitry a lack of electrical balance that in turn creates additionaldiscontinuities with their presence in the energized circuit system.

A superior approach when utilizing various interconnection platforms andmethodologies for direct IC chip attachment configurations to a PCB orother package connections is to provide low impedance from the energypathways or electrode planes using a single embodiment. It isimpractical to utilize many discrete, low impedance de-couplingcapacitors on an interposer or PCB, if low impedance energy planes arenot available to hook them up.

This application expands upon this concept and further discloses a newcircuit interposer comprising a multi-layer, universal multi-functional,common conductive shield structure with conductive pathways thatreplaces multiple, discreet versions of various prior art componentswith a single individual unit that provides a cost effective, singlecomponent embodiment variations of what the applicants believe to be anew universal system of circuit protection and conditioning that willhelp solve or reduce industry problems and obstacles as described abovewith simplicity and an exponential effectiveness.

Accordingly, the solution to low impedance energy distribution aboveseveral hundred MHz lies in thin dielectric energy plane technology, inaccordance with the present invention, which is much more effective thanmultiple, discrete decoupling capacitors.

Therefore, it is also an object of the invention to be able to operateeffectively across a broad frequency range as compared to a singlediscrete capacitor component or a multiple passive conditioning networkwhile maintaining a complete energy delivery protocol to a single ormultiple units of active components utilizing portions of propagatingenergy within a circuit. Ideally, this invention can be universal in itsapplication potentials, and by utilizing various embodiments ofpredetermined grouped elements, a working invention will continue toperform effectively within a system operating beyond 1 GHz of frequency.

To propagate electromagnetic interference energy, two fields arerequired, an electric field and a magnetic field. Electric fields coupleenergy into circuits through the voltage differential between two ormore points Changing electrical fields in a space give rise to amagnetic field. Any time-varying magnetic flux will give rise to anelectric field. As a result, a purely electric or purely magnetictime-varying field cannot exist independent of each other. Maxwell'sfirst equation is known as the divergence theorem based on Gauss's law.This equation applies to the accumulation of an electric charge thatcreates an electrostatic field, (“E-Field”) and is best observed betweentwo boundaries, conductive and nonconductive. This boundary conditionbehavior referenced in Gauss's law causes a conductive enclosure (alsocalled a Faraday cage) to act as an electrostatic shield.

At a pre-determined boundary or edge, electric charges can be kept onthe inside of the internally located conductive boundary of a pathway ofthe invention as a result of pre-determined design actions taken whenthe invention was built, specific manufacturing methodologies andtechniques described herein account for the end product performance whenplaced into a circuit and energized.

Electric charges that exist outside a pre-determined boundary or edge ofthe internal conductive boundary of a pathway inside the invention arealso excluded from effecting the very same internally generated fieldstrying to leave the same conductive pathways.

Maxwell's second equation illustrates that there are no magnetic charges(no monopoles), only electric charges. Electric charges are eitherpositively charged or negatively charged. Magnetic fields are producedthrough the action of electric currents and fields. Electric currentsand fields (“E-Field”) emanate as a point source. Magnetic fields formclosed loops around the current that generates fields located on alongthe energized conductive pathways. Maxwell's third equation, also calledFaraday's Law of Induction, describes a magnetic field (H-Field)traveling in a closed loop circuit, generating current. The thirdequation describes the creation of electric fields from changingmagnetic fields. Magnetic fields are commonly found in transformers orwindings, such as electric motors, generators, and the like. TogetherMaxwell's third & fourth equations describe how coupled electric andmagnetic fields propagate (radiate) at the speed of light. This equationalso describes the concept of “skin effect,” which predicts theeffectiveness of magnetic shielding and can even predict theeffectiveness of non-magnetic shielding.

There are two kinds of grounds normally found in today's electronics:earth-ground and circuit ground. The earth is not an equipotentialsurface, so earth ground potential can vary. Additionally, the earth hasother electrical properties that are not conducive to its use as areturn conductor in a circuit. However, circuits are often connected toearth ground for protection against shock hazards. The other kind ofground or common conductive pathway, circuit common conductive pathway,is an arbitrarily selected reference node in a circuit-the node withrespect to which other node voltages in the circuit are measured. Allcommon conductive pathway points in the circuit do not have to go to anexternal grounded trace on a PCB, Carrier or IC Package, but can betaken directly to the internal common conductive pathways. This leaveseach current loop in the circuit free to complete itself in whateverconfiguration yields minimum path of least impedance for portions ofenergy effected in the AOC of the new invention. It can work forfrequencies wherein the path of least impedance is primarily inductive.

With respect to grounding as just described above, there are at leastthree shielding functions that occur within the invention. First, aphysical shielding of differential conductive pathways accomplished bythe size of the common conductive pathways in relationship to the sizeof the differentially conductive pathways and by the energized,electrostatic suppression or minimization of parasitics originating fromthe sandwiched differential conductors as well as preventing externalparasitics not original to the contained differential pathways fromconversely attempting to couple on to the shielded differentialpathways, sometimes referred to among others as capacitive coupling.Capacitive coupling is known as electric field (“E”) coupling and thisshielding function amounts to primarily shielding electrostaticallyagainst electric field parasitics. Capacitive coupling involving thepassage of interfering propagating energies because of mutual or straycapacitances that originate from the differential conductor pathways issuppressed within the new invention. The invention blocks capacitivecoupling by almost completely enveloping the oppositely phasedconductors within Faraday cage-like conductive shield structures(‘FCLS’) that provide an electrostatic or Faraday shield effect and withthe positioning of the layering and pre-determined layering positionboth vertically and horizontally (inter-mingling).

In other prior art devices, if shield coverage is not 100%, the shieldstructure is usually grounded to ensure that circuit-to-shieldcapacitances go to propagating energy reference common conductivepathway rather than act as feedback and cross-talk elements. However,the present invention can use an internal propagating energy referencecommon conductive pathway or an image ground within the device for this.The device's FCLS are used to suppress and prevent internal and external(with respect to the AOC) capacitive coupling between a potentiallynoisy conductor and a victim conductor, by an imposition of commonconductive pathway layers positioned between each differentialconductive pathway conductors any stray capacitance.

Secondly, a conductor positioning shielding technique which is usedagainst inductive energy coupling and is also known as mutual inductivecancellation or minimization of portions of energy propagating alongseparate and opposing conductive pathways.

Finally, a physical shielding function for RF noise. Inductive couplingis magnetic field (“H”) coupling, so this shielding function amounts toshielding against magnetic shields and this shielding occurs with in thedevice through mutual cancellation or minimization. RF shielding is theclassical “metallic barrier” against all sorts of electromagnetic fieldsand is what most people believe shielding is about. There are twoaspects to defending a circuit against inductive pickup. One aspect isto try to minimize the offensive fields at their source This is done byminimizing the area of the current loop at the source so as to promotefield cancellation or minimization, as described in the section oncurrent loops. The other aspect is to minimize the inductive pickup inthe victim circuit by minimizing the area of that current loop, since,from Lenz's law; the induced voltage is proportional to this area. Sothe two aspects really involve the same cooperative action: minimize theareas of the current loops. In other words, minimizing the offensivenessof a circuit inherently minimizes its susceptibility. Shielding againstinductive coupling means nothing more than controlling the dimensions ofthe current loops in the circuit. The RF current in the circuit directlyrelates to signal and energy distribution networks along with bypassingand decoupling.

RF currents are ultimately generated as harmonics of clock and otherdigital signals. Signal and propagating energy distribution networksmust be as small as possible to minimize the loop area for the RF returncurrents. Bypassing and decoupling relate to the current draw that mustoccur through a propagating energy distribution network, which has bydefinition, a large loop area for RF return currents. In addition, italso relates to the loop areas that must be reduced, electric fieldsthat are created by improperly contained transmission lines andexcessive drive voltage.

The best way to minimize loop areas when many current loops are involvedis to use a common conductive pathway. The idea behind RF shielding isthat time-varying EMI fields induce currents in the shielding material.The freedom to use any material and dielectric in the construction ofthe assembly allows this constraint to be overcome. More formally,losses commonly referred to an absorption loss, re-radiation losses, orreflection loss, can be more controlled.

A common conductive pathway is a conducting surface that is to serve asa return conductor for all the current loops in the circuit. Theinvention uses its common conductive shields as an separate internalcommon conductive pathway located between but sandwiching thenon-aperture using conductors to provide a physically tight or minimizedenergy loop between the interposer and the active chip that the energyis being condition for. A hole-thru, common conductivepathway-possessing structure works as well as a non-hole element of theassembly as far as for minimizing loop area is concerned. The key toattaining minimum loop areas for all the current loops together is tolet the common conductive pathway currents distribute themselves aroundthe entire area of the component's common conductive pathway areaelements as freely as possible.

By surrounding predetermined conductive pathway electrodes withcage-like structures made up with one centralized and shared, commonconductive pathway or area, this common pathway or area becomes a0-reference common conductive pathway for circuit voltages and existsbetween at least two oppositely phased or voltage potential conductivestructures which in turn are located each respectively on opposite sidesof the just described sandwiched centralized and shared, commonconductive pathway or area.

The addition of two additional common conductive pathways can be addedto the previously disclosed five common conductive pathways into anelectrically common structure that now almost completely envelopes thetwo differentially energized pathways as just described is a type ofconfiguration that significantly completes the energized functions ofsuppressing or minimizing E-Fields and H-fields, stray capacitances,stray inductances, parasitics, and allowing for mutual cancellation orminimization of oppositely charged or phased, adjoining or abutting,electrical fields of the variously positioned propagating energypathways. In the last step for the horizontal layering process of a7-layer interposer, two additional common pathways sandwich the first5-layers as previously described. A SCM or MCM, for example, built withthe invention can take advantage of the various third conductivepathways common to one another or to the grounding, schemes used now bylarge SCM and MCM manufacturers.

In the invention, the feed path for portions of propagating energy andthe return path for similar portions of propagating energy with in theinvention are separated by microns of distance and normally by only by acommon conductive pathway and some predetermined dielectric. Such aconfiguration allows for suppression or minimization and minimizes orcancels the portions of circuit energy that exists in the magnetic fieldand that is produced by this very tiny current loop. Maintaining a veryeffective mutual cancellation or minimization of inductance of opposingbut shielded differential conductive pathways will effect the minimalmagnetic flux remaining and means minimal susceptibility to inductivecoupling, anywhere internally of the inventions elements.

The new invention mimics the functionality of an electrostaticallyshielded, transformer. Transformers are also widely used to providecommon mode (CM) isolation. These devices depend on a differential modetransfer (DM) across their input to magnetically link the primarywindings to the secondary windings in their attempt to transfer energy.As a result, CM voltage across the primary winding is rejected. One flawthat is inherent in the manufacturing of transformers is propagatingenergy source capacitance between the primary and secondary windings. Asthe frequency of the circuit increases, so does capacitive coupling;circuit isolation is now compromised. If enough parasitic capacitanceexists, high frequency RF energy (fast transients, ESD, lighting, etc.)may pass through the transformer and cause an upset in the circuits onthe other side of the isolation gap that received this transient event.Depending on the type and application of the transformer, a shield maybe provided between the primary and secondary windings. This shield,connected to a common conductive pathway reference source, is designedto prevent against capacitive coupling between the two sets of windings.

The new invention also resembles in energy transfer or energypropagation the workings of a transformer and the new device effectivelyuses not just a physical shield to suppress parasitics and such, it alsouses positioning of it's layering, connections of the layering, and theexternal combination with an external circuitry, to effectively functionin a novel and unexpected way.

If a system is being upset by AC line transients, this type of functionwill provide the fix. In prior art devices, to be effective in this typeof application; a shield must be connected to an external commonconductive pathway. However, the new invention provides an alternativeto this axiom. A passive architecture, such as utilized by theinvention, can be built to condition or minimize both types of energyfields that can be found in an electrical system. While the invention isnot necessarily built to condition one type of field more than another,however, it is contemplated that different types of materials can beadded or used to build an embodiment that could do such specificconditioning upon one energy field over another. In the invention,laying horizontal perimeter connections on the sides of the passivecomponent element of the assembly or placement of vertical aperturesthrough passive element, selectively coupling or not coupling these VIASand/or conductively filled apertures, allows the passage of propagatingenergy transmissions to occur as if they were going a feed-through-likefiltering device.

When prior art interposers are placed into a circuit and energized,their manufacturing tolerances of the devices are carried to the circuitand revealed at circuit energization. These imbalance variables aremultiplied with the addition of multiple pathways and cause voltageimbalances in the circuit.

Use of the invention will allow placement into a differentially operatedcircuitry and will provide a virtually electrically balanced andessentially, equal capacitance, inductive and resistance tolerances ofone invention unit, that is shared and located between each pairedenergy pathway within the device, equally, and in a balanced electricalmanner. Invention manufacturing tolerances or pathway balances between acommonly shared central conductive pathway found internally within theinvention is maintained at levels that originated at the factory duringmanufacturing of the invention, even with the use of commonnon-conductive materials, dielectrics or conductive materials, which arewidely and commonly specified among discrete units. Thus, an inventionthat is manufactured at 5% tolerance, when manufactured as described inthe disclosure will also have a correlated 5% electrical tolerancebetween single or multiple, paired energy pathways in the invention whenplaced into an energized system. This means that the invention allowsthe use of relatively inexpensive materials, due to the nature of thearchitecture's minimal structure such that variation is reduced and theproper balance between energized paired pathways or differential energypathways is obtained.

Expensive, non-commonly used, specialized, dielectric materials are nolonger needed for many delicate bypass and/or energy decouplingoperations in an attempt to maintain a energy conditioning balancebetween two system conductive pathways, as well as giving an inventionusers the opportunity to use a single balanced element that ishomogeneous in material make up within the entire circuit. The newinvention can be placed between paired or a paired plurality of energypathways or differential conductive pathways in the invention, while thecommon conductive pathways that also make up the invention can beconnected to a third conductive pathway or pathways that are common toall elements of the common conductive pathways internal in the inventionand common to an external conductive area, if desired.

The invention will simultaneous provide energy conditioning functionsthat include bypassing, energy, energy line decoupling, energy storagesuch that the differential electrodes are enveloped within theembodiment shield structure and are free from almost all internallygenerated capacitive or energy parasitics trying to escape from theenveloped containment area surrounding each of the conductive pathwayelectrodes. At the same time, the shield structure will act to preventany externally generated energy parasitics such as “floatingcapacitance” for example from coupling onto the very same differentialconductive pathways due to the physical shielding and the separation ofthe electrostatic shield effect created by the energization of thecommon conductive structure and its attachment with common means know tothe art to an internally or externally located conductive area orpathway.

Attachment to an external conductive area includes an industryattachment methodology that includes industry accepted materials andprocesses used to accomplish connections that can be applied in mostcases openly without additional constraints imposed when using adifferent device architecture. Through other functions such ascancellation or minimization of mutually opposing conductors, theinvention allows a low impedance pathway to develop within a Faradaycage-like unit with respect to the enveloping conductive common shieldspathways that can subsequently continue to move energy out onto anexternally located conductive area that can include, but is not limitedto, a “floating’, non-potential conductive area, circuit or systemground, circuit system return, chassis or PCB ground, or even an earthground.

The various attachment schemes described herein will normally allow a“0” voltage reference to develop with respect to each pair or pluralityof paired differential conductors located on opposite sides of theshared central and common conductive pathway, and be equal yet oppositefor each unit of a separated paired energy pathway or structure, betweenthe centrally positioned interposing, common conductive shield pathwayused. Use of the invention allows voltage to be maintained and balancedeven with multiple SSO (Simultaneous Switching Operations) states amongtransistor gates located within an active integrated circuit all withoutcontributing disruptive energy parasitics back into the energized systemas the invention is passively operated, within its attached circuit.

Thus, parasitics of all types are minimized from upsetting thecapacitance, inductive and resistance tolerances or balance that weremanufactured into the unenergized invention. The prior art has normallyallowed effects from free parasitics in both directions to disrupt acircuit despite the best attempts to the contrary with all prior artdevices to date.

As previously noted, propagated electromagnetic interference can be theproduct of both electric and magnetic fields. Until recently, emphasisin the art has been placed upon on filtering EMI from circuit or energyconductors carrying high frequency noise with DC energy or current.However, the invention is capable of conditioning energy that uses DC,AC, and AC/DC hybrid-type propagation of energy along conductivepathways found in an electrical system or test equipment. This includesuse of the invention to condition energy in systems that contain manydifferent types of energy propagation formats, in systems that containmany kinds of circuitry propagation characteristics, within the sameelectrical system platform.

Principals of a Faraday cage-like conductive shield like are used whenthe common conductive pathways are joined to one another and thegrouping of these conductive pathways, together co-act with the larger,external conductive pathway, pathway area or surface that provides agreater conductive surface area in which to dissipate over voltages andsurges and initiate Faraday cage-like conductive shield structureelectrostatic functions of suppression or minimization of parasitics andother transients, simultaneously. When a plurality of common conductivepathways as just described are electrically coupled as either a system,circuit reference node, or chassis ground, they can be relied upon as acommonly used, reference common conductive pathway for a circuit inwhich the invention is placed into and energized.

One or more of a plurality of conductive or dielectric materials havingdifferent electrical characteristics from one another can be insertedand maintained between common conductive pathways and differentialelectrode pathways. Although a specific differential pathway can becomprised of a plurality of commonly conductive structures, they areperforming differentially phased conditioning with respect to a “mate”or paired plurality of oppositely phased or charged structures that formhalf of the total sum of all of the manufactured differential conductivepathways contained with in the structure. The total sum of thedifferential pathways will also will normally be separated electricallyin an even manner with equal number of pathways used simultaneously butwith half the total sum of the individual differential conductivepathways approximately 180 degrees out of phase from the oppositelypositioned groupings. Microns of dielectric and conductive materialnormally includes a predetermined type of dielectric along with ainterposing and shield functioning common conductive pathway, which inalmost all cases and do not physically couple to any of thedifferentially operating conductive pathways within the invention,itself or its AOC.

In contrast to the prior art, the new invention to provides a means oflowering circuit impedance facilitated by providing interaction ofmutually opposing conductive pathways that are maintained in what isessentially, a parallel relationship, respectively within the interposerand with respect to the circuit energy source and the circuit'senergy-utilizing load when attached and energized into circuitry betweenthese their energy conduits and to a circuit reference node or commonconductive pathway used as a low circuit impedance pathway by portionsof propagating energy. At the same time, a entirely different group ofmutually opposing conductive pathway elements can be maintained in whatis essentially, a parallel relationship respectively to one another andyet be physically perpendicular to the first set of parallel mutuallyopposing conductive pathway elements simultaneously working inconjunction with the second set just described.

The user has options of connection to an external GnD area, analternative common conductive return path, or simply to an internalcircuit or system circuit common conductive pathway or common conductivenode. In some applications, it might be desired by the user toexternally attach to additional numbers of paired external conductivepathways not of the original differential conductive pathways to takeadvantage of the lowering of circuit impedance occurring within theinvention. This low impedance path phenomenon can occur by usingalternative or auxiliary circuit return pathways, as well. In this case,at energization, the various internal and simultaneous functionsoccurring to create a low impedance conductive pathway along the commonconductive pathways internal to the new inventive structure is used byportions of energy propagating along the differential conductivepathways in essentially a parallel manner and within the interposer asit normally operates in a position, physically placed in between thevarious conductive pathways, running from energy source and theenergy-utilizing load and back as attached into an energized circuit.Differential conductive energy pathways will be able utilize a circuit“0” Voltage reference image node or “0” Voltage common conductivepathway node created along the internal common conductive pathway inconjunction with the common conductive energy pathway shields thatsurround the differential conductive pathways almost completely, andcoact as a joined together common conductive structure to facilitateenergy propagation along the low impedance pathway, not of thedifferential pathways and allowing unwanted EMI or noise to move to thiscreated pathway at energization and passive operations rather thandetrimentally effecting the very circuit and portions of energy that arebeing conditioned in the AOC of the new interposer.

The attached plurality of internal common conductive electrode pathwaysthat make up a Faraday cage-like conductive shield structure as part ofthe whole interposer invention will allow the external common conductivearea or return pathway to become, in essence, an extended version ofitself, internally and closely positioned in an essentially parallelarrangement only microns of distance from differentially operatingconductive pathways that are them selves extensions of the externaldifferential conductive elements with respect to their position locatedapart and on either side of at least one common conductive pathway thatis taking on multiple shielding functions simultaneously duringenergization. This phenomena occurs internally in other embodiments suchas, but not limited to, printed circuit boards (PCB), daughter cards,memory modules, test connectors, connectors, interposers for Single ChipModules or Multi-Chip Modules (SCM or MCM) or other integrated circuitpackages utilizing interposer interconnection at subsequentenergization.

Additional objects and advantages of the invention will become apparentto those skilled in the art upon reference to the detailed descriptiontaken in conjunction with the provided figures.

Turning now to FIG. 1, an exploded perspective view of multi-functionalenergy conditioner 10's physical architecture is shown. Multi-functionalenergy conditioner 10 is comprised of a plurality of common conductivepathways 14 at least two electrode pathways 16A and 16B where eachelectrode pathway 16 is sandwiched between two common conductivepathways 14. At least one pair of electrical conductors 12A and 12B isdisposed through insulating apertures 18 or coupling apertures 20 of theplurality of common conductive pathways 14 and electrode pathways 16Aand 16B with electrical conductors 12A and 12B also being selectivelyconnected to coupling apertures 20 of electrode pathways 16A and 16B.Common conductive pathways 14 comprise of a conductive material such asmetal in a different embodiment, or in the preferred embodiment, theycan have conductive material deposited onto a dielectric material orlaminate (not shown) similar to processes used to manufactureconventional multi-layered chip capacitors or multi-layered chip energyconditioning elements and the like. At least one pair of insulatingapertures 18 are disposed through each common conductive pathwayelectrode 14 to allow electrical conductors 12 to pass through whilemaintaining electrical isolation between common conductive pathways 14and electrical conductors 12. The plurality of common conductivepathways 14 may optionally be equipped with fastening apertures 22arranged in a predetermined and matching position to enable each of theplurality of common conductive pathways 14 to be coupled securely to oneanother through standard fastening means such as screws and bolts or inalternative embodiments (not shown) by means that allow the device to bemanufactured and joined into a standard monolithic-like, multilayerembodiments similar to the processes used in the industry to manufactureprior art chip energy conditioning elements and the like. Fasteningapertures 22 or even a solder attachment of common industry means andmaterials that can subsequently place conductive termination bands (notshown) may also be used to secure multi-functional energy conditioner 10to another non-conductive or common conductive surface such as anenclosure or chassis of the electronic system or device themulti-functional energy conditioner 10 is being used in conjunctionwith.

Electrode pathways 16A and 16B are similar to common conductive pathways14 in that they are comprised of a conductive material or in a differentembodiment, can have conductive material deposited onto a dielectriclaminate (not shown) or similar, that would allow the new embodiment tobe manufactured and joined into a standard monolithic-like, multilayerembodiments similar to the processes used in the industry to manufactureprior art chip energy conditioning elements and the like and haveelectrical conductors 12A and 12B disposed through respective apertures.Unlike joined, common conductive pathways 14, electrode pathways 16A and16B are selectively electrically connected to one of the two electricalconductors 12. While electrode pathways 16, as shown in FIG. 1, aredepicted as smaller than common conductive pathways 14 this is notrequired but in this configuration has been done to prevent electrodepathways 16 from interfering with the physical coupling means offastening apertures 22 or other bonding methods (not shown) and shouldbe ideally inset within the common conductive pathways 14 and thus theyposses a smaller conductive area than common conductive pathways 14.

Electrical conductors 12 provide a current path that flows in thedirection indicated by the arrows positioned at either end of theelectrical conductors 12 as shown in FIG. 1. Electrical conductor 12Arepresents an electrical propagating conveyance path and electricalconductor 12B represents the propagating energy return path. While onlyone pair of electrical conductors 12A and 12B is shown, Applicantcontemplates multi-functional energy conditioner 10 being configured toprovide filtering with a plurality of pairs of electrical conductorslike 12A and 12B, as well as, electrode pathways 16A and 16B and commonconductive pathways 14 which are joined together for creating ahigh-density multi-conductor multi-functional energy conditioner.

Another element which makes up multi-functional energy conditioner 10 ismaterial 28 which has one or a number of electrical properties andsurrounds the center common conductive pathway electrode 14, bothelectrode pathways 16A and 16B and the portions of electrical conductors12A and 12B passing between the two outer common conductive pathways 14in a manner which isolates the pathways and conductors from one anotherexcept for the connection created by the conductors 12A and 12B andcoupling aperture 20. The electrical characteristics of multi-functionalenergy conditioner 10 are determined by the selection of material 28. Ifan X7R dielectric material is chosen, for example, multi-functional,energy conditioner 10 will have primarily capacitive characteristics.Material 28 may also be a metal oxide varistor material that willprovide capacitive and surge protection characteristics. Other materialssuch as ferrites and sintered polycrystalline may be used whereinferrite materials provide an inherent inductance along with surgeprotection characteristics in addition to the improved common mode noisecancellation or minimization that results from the mutual couplingcancellation or minimization effect. The sintered polycrystallinematerial provides conductive, dielectric, and magnetic properties.Sintered polycrystalline is described in detail in U.S. Pat. No.5,500,629, which is herein incorporated by reference.

Still referring to FIG. 1, the physical relationship of commonconductive pathways 14, electrode pathways 16A and 16B, electricalconductors 12A and 12B and material 28 will now be described in moredetail. The starting point is center common conductive pathway electrode14. Center pathway 14 has the pair of electrical conductors 12 disposedthrough their respective insulating apertures 18 which maintainelectrical isolation between common conductive pathway electrode 14 andboth electrical conductors 12A and 12B. On either side, both above andbelow, of center common conductive pathway electrode 14 are electrodepathways 16A and 16B each having the pair of electrical conductors 12Aand 12B disposed there through. Unlike center common conductive pathwayelectrode 14, only one electrical conductor, 12A or 12B, is isolatedfrom each electrode pathway, 16A or 16B, by an insulating aperture 18.One of the pair of electrical conductors, 12A or 12B, is electricallycoupled to the associated electrode pathway 16A or 16B respectivelythrough coupling aperture 20. Coupling aperture 20 interfaces with oneof the pair of electrical conductors 12 through a standard connectionsuch as a solder weld, a resistive fit or any other standardinterconnect methodology to provide a solid and secure physical andelectrical connection of predetermined conductive pathways. Formulti-functional energy conditioner 10 to function properly, upperelectrode pathway 16A must be electrically coupled to the oppositeelectrical conductor 12A than that to which lower electrode pathway 16Bis electrically coupled, that being electrical conductor 12B.Multi-functional energy conditioner 10 optionally comprises a pluralityof outer common conductive pathways 14.

These outer common conductive pathways 14 provide a significantly largerconductive common conductive pathway and/or image plane when theplurality of common conductive pathways 14 are electrically connected toan outer edge conductive band 14A by conductive termination material orattached directly by tension seating means or commonly used solder-likematerials to an larger external conductive surface. 14A and 14B (notshown) that are physically separate of the differentially conductivepathways 16A and 16B and/or any plurality of electrical conductors suchas 12A and 12B for example. Connection to an external conductive areahelps with attenuation of radiated electromagnetic emissions andprovides a greater surface area in which to dissipate over voltages andsurges. Connection to an external conductive area helps electrostaticsuppression or minimization of any inductive or parasitic strays thatcan radiate or be absorbed by differentially conductive pathways 16A and16B and/or any plurality of differential electrical conductors such as12A and 12B for example.

Principals of a Faraday cage-like conductive shield structure are usedwhen the common pathways are joined to one another as described aboveand the grouping of common conductive pathways together coact with thelarger external conductive area or surface to suppress radiatedelectromagnetic emissions and provide a greater conductive surface areain which to dissipate over voltages and surges and initiate Faradaycage-like conductive shield structure electrostatic functions ofsuppression or minimization of parasitics and other transients,simultaneously. This is particularly true when plurality of commonconductive pathways 14 are electrically coupled to earth ground but arerelied upon to provide an inherent common conductive pathway for acircuit in which the invention is placed into and energized with. Asmentioned earlier, inserted and maintained between common conductivepathways 14 and both electrode pathways 16A and 16B is material 28 whichcan be one or more of a plurality of materials having differentelectrical characteristics.

FIG. 1A shows an alternative embodiment of multi-functional energyconditioner 10, which includes additional means of coupling electricalconductors or circuit board connections to multi-functional energyconditioner 10. Essentially, the plurality of common conductive pathways14 are electrically connected together by the sharing of a separatelylocated outer edge conductive band or bands 14A and/or 14B (not shown)at each conductive electrode exit and which in turn, are then joinedand/or connected to the same external conductive surface (not shown)that can possess a voltage potential when the invention is placed into aportion of a larger circuit and energized. This voltage potential coactswith the external conductive surface area or areas through conductivebands 14A and/or 14B (not shown) and the internal common conductiveelectrodes 14 of the embodiment, as well as any of the conductiveelements (shown or not shown) that are needed to utilize a connectionthat allows energy to propagate.

In addition, each differential electrode pathway 16A and 16B has its ownouter edge conductive bands or surface, 40A and 40B respectively. Toprovide electrical connections between electrode pathway 16A and 16B andtheir respective conductive band 40A and 40B while at the same timemaintaining electrical isolation between other portions ofmulti-functional energy conditioner 10, each electrode pathway 16 iselongated and positioned such that the elongated portion of electrodepathway 16A is directed opposite of the direction electrode pathway 16Bis directed. The elongated portions of electrode pathways 16 also extendbeyond the distance in which the plurality of common conductive pathwayscommon conductive pathways 14 extend with the additional distanceisolated from outer edge conductive bands 40A and 40B by additionalmaterial 28. Electrical connection between each of the bands and theirassociated pathways is accomplished through physical contact betweeneach band and its associated common conductive or conductive electrodepathway, respectively.

FIG. 2 shows a quasi-schematic circuit representation of an energizedportion of a circuit when the physical embodiment of multi-functionalenergy conditioner 10 is mated into a larger circuit and energized.Line-to-line energy conditioning element 30 is comprised of electrodepathways 16A and 16B where electrode pathway 16A is coupled to one ofthe pair of electrical conductors 12A with the other electrode pathway16B being coupled to the opposite electrical conductor 12B therebyproviding the two parallel pathways necessary to form a energyconditioning element. Center common conductive pathway electrode 14 isan essential element among all embodiments or connotations of theinvention and when joined with the sandwiching outer two commonconductive pathways 14 together act as inherent common conductivepathway 34 and 34 b which depicts conductive band 14 and 14B (not shown)as connecting to a larger external conductive area 34 (not shown) andline-to-line energy conditioning element 30 and also serves as one ofthe two parallel pathways for each line-to-common conductive pathwayenergy conditioning element 32.

The second parallel pathway required for each line-to-common conductivepathway energy-conditioning element 32 is supplied by the correspondingelectrode pathway 16B. By carefully referencing FIG. 1 and FIG. 2, theenergy conditioning pathway relationships will become apparent. Byisolating center common conductive pathway electrode 14 from eachelectrode pathway 16A or 16B with material 28 having electricalproperties, the result is a energy conditioning network having a commonmode bypass energy conditioning element 30 extending between electricalconductors 12A and 12B and line-to-common conductive pathway decouplingenergy conditioning elements 32 coupled from each electrical conductor12A and 12B to larger external conductive area 34.

The larger external conductive area 34 will be described in more detaillater but for the time being it may be more intuitive to assume that itis equivalent to earth or circuit ground. The larger external conductivearea 34, can be coupled with the center and the additional commonconductive pathways 14 to join with said central pathway 14 to form, oneor more of common conductive pathways 14 that are conductively joinedand can be coupled to circuit or earth ground by common means of the artsuch as a soldering or mounting screws inserted through fasteningapertures 22 or just laminated as a standard planar multilayered ceramicembodiment (not shown) with externally deposited conductive materiallike 14A and 14B which are then together coupled to the same externalcommon conductive area or pathway (not shown) an enclosure or groundedchassis of an electrical device. While multi-functional energyconditioner 10 works equally well with inherent common conductivepathway 34 coupled to earth or circuit common conductive pathway, oneadvantage of multi-functional energy conditioner 10's physicalarchitecture is that depending upon energy condition that is needed, aphysical grounding connection can be unnecessary in some specificapplications.

Referring again to FIG. 1 an additional feature of multi-functionalenergy conditioner 10 is demonstrated by clockwise and counterclockwiseflux fields, 24 and 26 respectively. Maxwell's fourth equation, which isalso identified as Ampere's law, states that magnetic fields arise fromtwo sources, the first source is described as current flow in the formof a transported electrical charge and the second source is described byhow the changes in electric fields traveling in a closed loop circuitwill subsequently create simultaneous, magnetic fields. Of the twosources just mentioned, transported electrical charge is the descriptionof how electric currents create magnetic fields that if the conductivesource pathway and the return energy pathway are so positioned,mathematical equations can be used to describe how E & H Fields can besuppressed or minimized within the new interposer device.

To minimize RF currents within any passive component or layeredstructure that is being used in an energy transmission network, theconcept of flux cancellation or flux minimization needs to be used.Because magnetic lines of flux travel counterclockwise within atransmission line or line conductor or layer, if we bring the RF returnpath parallel and adjacent to its corresponding source trace, themagnetic flux lines observed in the return path (counterclockwisefield), related to the source path (clockwise field), will be in theopposing directions. When we combine a clockwise field with acounterclockwise field, a cancellation or minimization effect isobserved.

If unwanted magnetic lines of flux between a source and return path arecanceled or minimized, then a radiated or conducted RF current cannotexist except within the minuscule boundary of the conductive pathwayinside. However, by using techniques described herein, this minusculeboundary of escaping RF energy is critical in high-speed applicationsand is effectively contained by the energized shield structure almostentirely enveloping the differential conductive pathway. The concept ofimplementing flux cancellation or minimization is simple, especiallywhen the opposing conductors can be positioned vertically andhorizontally with respect to the earth's horizon, within microns ofdistance to one another. The invention suppression or minimizationtechniques occurring simultaneous to one another during fluxcancellation or minimization creates and follows convention theory as itis prescribed with the use of image planes or nodes. Regardless of howwell designed a passive component is, magnetic and electric fields willnormally be present to some small insignificant amount, even at speedsabove 2 Gigahertz and beyond. However, if we cancel or minimize magneticlines of flux effectively and than combine this cancellation orminimization technique with use of an image plane and shieldingstructures then EMI cannot exist.

To explain this concept further, the direction of the individual fluxfields is determined and may be mapped by applying Ampere's Law andusing the right hand rule. In doing so, an individual places their thumbparallel to and pointed in the direction of current flow throughelectrical conductors 12A or 12B as indicated by the arrows at eitherends of the conductors. Once the thumb is pointed in the same directionas the current flow, the direction in which the remaining fingers on theperson's hand curve indicates the direction of rotation for the fluxfields. Because electrical conductors 12A and 12B are positioned next toone another and they can also represent a more than one current loop asfound in many I/O and data line configurations, the currents enteringand leaving multi-functional energy conditioner 10 oppose one another,thereby creating a closely positioned opposed flux fields 18, 20, 24, 26which cancel or minimize each other and cancel or minimize inductanceattributed to the device.

Low inductance is advantageous in modern I/O and high-speed data linesas the increased switching speeds and fast pulse rise times of modernequipment create unacceptable voltage spikes which can only be managedby low inductance surge devices and networks. It should also be evidentthat labor intensive aspects of using multi-functional energyconditioner 10 as compared to combining discrete components found in theprior art provides an easy and cost effective method of manufacturing.Because connections only need to be made to either ends of electricalconductors 12 to provide a line to line capacitance to the circuit thatis approximately half the value of the capacitance measured for each ofthe line to common conductive pathway capacitance also developedinternally within the embodiment. This provides flexibility for the useras well as providing a potential savings in time and space inmanufacturing a larger electrical system utilizing the invention.

A portion of a Faraday-cage-like common conductive shield structurefound in the present invention is shown in detail in FIG. 3 and in FIG.4. Accordingly, discussion will move freely between FIG. 3 and FIG. 4 todisclose the importance that a Faraday-cage-like common conductiveshield structure plays in combination with various external commonconductive pathways. FIG. 3 shows a portion 800B, which comprises aportion of the complete Faraday cage-like conductive shield structure 20as shown in FIG. 4.

For FIG. 2A, see the discussion of FIGS. 4A-4D.

In FIG. 3, differential conductive by-pass electrode pathway 809 issandwiched between the shared, central common conductive pathway804/804-IM of structure 20 and common conductive pathway 810 (not shownin FIG. 3), which is seated above pathway 809 in depiction FIG. 4.Positioned above and below by-pass pathway 809 is a dielectric materialor medium 801. Common conductive pathways 804/804-IM and 810, as well aspathway 809, are all separated from each other for the most part by ageneral parallel interposition of a predetermined dielectric material ormedium 801, which is placed or deposited during the manufacturingprocess between each of said conductive pathway applications. All of theconductive common conductive pathways 860/860-IM, 840, 804/804-IM, 810,830, and 850/850-IM are offset a pre-determined distance 814 from theouter edge of embodiment 800B. In addition, all of the differentialconductive pathways 809 are offset an additional distance 806 from theouter edge of embodiment 800B such that the outer edge 803 ofdifferential conductive pathway 809 is overlapped by the edge 805 of thecommon conductive pathways. Accordingly, differential conductive pathway809 comprises a conductive area that will always be less than any of oneconductive area of any given said common conductive pathways' conductivearea when calculating its' total conductive area. The common conductivepathways will generally all possess nearly the same as manufacturabilitycontrollable conductive area that is homogenous in area size to onanother as well in general make-up. Thus, any one of the sandwichingcommon conductive pathway's will posses a total top and bottomconductive area sum always greater than the total conductive area topand bottom summed of any one differential conductive pathway and willalways be almost completely physically shielded by the conductive areaof any common conductive pathway of Faraday-cage-like common conductiveshield structure.

Looking at FIG. 4, it is seen that common pathways 860/860-IM, 840,804/804-IM, 810, 830, and 850/850-IM are also surrounded by dielectricmaterial 801 that provides support and outer casing of the interposercomponent. Conductive connection material or structures 802A and 802Bare applied to a portion of said common shield pathway structures edges805 of said common pathways of a structure 20 on at least two sides asis depicted in FIG. 4 and as is depicted for 804/804-IM in FIG. 3. Thisenables the electrical conditioning functions to operate properly inthis type of embodiment. A break down of structure 20 into even smaller,paired, cage-like conductive structure portions reveals for exampleconductive structure 900A which is further comprised of commonconductive pathways 804/804-IM, 808 and 810, individually, and nowtogether, with common conductive material connections 802A and 802B thatwill form a single, common conductive, center structure 900A of largerstructure 20 that would alone, operate sufficiently as one commonconductive cage-like structure of 900A, if built as such, individuallyand connected in a similar manner into a circuit.

To condition additional differential conductive pathways (not shown), aspart of a larger stacking of a interposer utilizing common conductivepathway electrodes could be added in a pre-determined fashion, forby-pass as shown in FIG. 3 or for a feed-thru configuration, not shown,but disclosed in pending applications referenced herein. All that isneeded for proper device functions, as long as conductive connectionmaterial connections 802A and 802B maintain physical and electricalcontact with some portion of common pathways edge electrodes 805 ofeach, respective, common conductive pathways and as long as each andevery differential pathway is sandwiched by at least two commonconductive pathways and said differential conductive pathways areset-back in a generally equal 806 positioning so that the stacked yetseparated differential electrodes, each embodiment may operate the unitsminimization and suppression functions in a balanced manner with respectto conductive material areas as just discussed.

Returning to FIG. 4, paired, differential energy propagation shieldedcontainer comprising conductive pathways similar to 809 and 818 (notshown) in FIG. 3 will utilize conductive connection material orstructures 802A and 802B that comprises a conductive material generallyknown and used in the art to electrically connect conductive pathways toone another in a typical circuit system as can be done using prior artmethodologies.

Before embodiment 20 of FIG. 4 is placed into circuitry and energized,structures 802A and 802B should electrically connect conductive pathwaysto one another in a typical circuit system and provide externallylocated conductive pathways or areas (not shown) or same externalconductive paths (not shown) a good electrical connection without anyconductive interruption or gap between each respective conductivestructures 802A and 802B.

In FIG. 3, single cage-like structure 800B mirrors single cage-likestructure 800C except that differential electrode 818 (not shown)contained within, and exit/entrance sections 812A and 812B (not shown)as well as conductive pathway extension structures 812A and 812B (notshown), are positioned in a generally opposite placement positionrelative to one another or its paired mate in multi-paired applications,and will operate in an electrically balanced manner with one anotherconductive pathway differential electrode of conductive structure 809B(not shown) with exit/entrance section 812B (not shown) that can be in agenerally opposing direction, approx. 180 degrees to that of conductivepathway differential electrode of conductive structure 809A withexit/entrance section 812A. Differential structures contained withinthese two commonly conductive, cage-like structures or common containers800C and 800B are in a positioned and electrically parallelrelationship, but most importantly, structures 800C and 800B comprisingstructure 900A are sharing the same, central common conductive sharedpathway 804/804-IM, that makes up part of each smaller cage-likestructures, 800C and 800B, when taken individually. Together, 800C and800B create a single and larger conductive Faraday-cage-like commonconductive shield structure 900A that acts as a double or pairedshielded common conductive pathway container.

Each container 800C and 800B can hold an equal number of same sized,differential electrodes that are not necessarily physically opposing oneanother within larger structure 900A, yet are oriented in a generallyphysically and electrically parallel manner, respectively. Larger,conductive faraday-cage-like common conductive shield structure 900Awith co-acting 800C and 800B individual shield-like structures, whenenergized, and attached to the same external common conductive path areaby common conductive material connections 802A and 802B by any possiblemeans of commonly acceptable industry attachment methods such as refluxsolder conductive epoxies and adhesives and the like (but not shown),become one electrically, at energization.

The predetermined arrangements of the common conductive electrodes areshown in FIG. 4, with common conductive electrode 810 and 808 with acentralized common shield 804/804-IM connected by common conductivematerial connections 802A and 802B to an external common conductivepathway or area are some of the elements that make up one commonconductive cage-like structure 900A. Common conductive cage-like 800B isan element of the present invention, namely the energy conditioninginterposer with circuit architecture.

The central common conductive shared pathway 804/804-IM with respect toits interposition between the differential electrodes 809 and 818 (notshown) needs the outer two additional sandwiching common electrodepathways 808 and 810 to be considered an un-energized, Faraday cage-likeconductive shield structure 900A. To go further, the central commonpathway 804/804-IM will be used simultaneously by both differentialelectrodes 809 and 818, at the same time, but with opposite results withrespective to charge switching.

The following sections that reference to common conductive pathway804/804-IM, also apply to common conductive pathways 808 and 810. Commonconductive pathway 804/804-IM is offset a distance 814 from the edge ofthe invention. One or more portions 811A and 811B of the commonconductive pathway electrode 804/804-IM extends through material 801 andis attached to common conductive band or conductive material structures802A and 802B. Although not shown, common 802A and 802B electricallyconnects common conductive pathways 804/804-IM, 808 and 810 to eachother and to all other common conductive pathways (860/860-IM, 840, 830,and 860/860-IM) if used.

This offset distance and area 806 of FIG. 3, enables the commonconductive pathway 804/804-IM to extend beyond the electrode pathway 809to provide a shield against portions of energy flux fields (not shown)which might have normally attempted to extend beyond the edge 803 of theelectrode pathway 809 but were it not for the electrostatic shieldingeffect of an energized faraday-like cage systems resulting in reductionor minimization of near field coupling between other internal electrodepathways such as 818 (not shown) or to external differential electrodepathways elements. The horizontal offset 806 can be stated asapproximately 0 to 20+ times the vertical distance 806 between theelectrode pathway 809 and the common conductive pathway 804/804-IM. Theoffset distance 806 can be optimized for a particular application, butall distances of overlap 806 among each respective pathway is ideally,approximately the same, as manufacturing tolerances will allow. Minorsize differences are unimportant in distance and area 806 betweenpathways as long as electrostatic shielding function (not shown) ofstructure 900A or structure 20 is not compromised.

In order to connect electrode 809 to energy pathways positioned externalto 809, yet on either side of the 800B, respectively (not shown), theelectrode 809 may have one, or a plurality of, portions 812 which extendbeyond the edge 805 of the common conductive pathways 804/804-IM and 808to a connection area 812A and 812B which are in turn conductivelyconnected to conductive pathway material, deposit or electrode 809A and809B, which enables the by-pass electrode 809 to be electricallyconnected to the energy pathways (not shown) on either side. It shouldbe noted that element 813 is a dynamic representation of the center axispoint of the three-dimensional energy conditioning functions that takeplace within the interposer invention (not shown) and is relative withrespect to the final size, shape and position of the embodiment in anenergized circuit.

Referring now to FIG. 4, the concept of the universal, multi-functional,common conductive shield structure (for use with the applicantsdiscreet, non-interposer energy conditioners) is shown. The universal,multi-functional, common conductive shield structure 20 comprisesmultiple, stacked, common conductive cage-like structures 900A, 900B and900C as depicted and which in turn are comprised of multiple, stacked,common conductive cage-like structures or containers 800A, 800B, 800C,and 800D (each referred to generally as 800X), in a generally parallelrelationship. Each common conductive cage like structure 800X comprisesat least two common conductive pathway electrodes, 830, 810, 804/804-IM,808, or 840. The number of stacked, common conductive cage-likestructures 800X is not limited to the number shown herein, and can beany even integer. Thus the number of stacked, common conductivecage-like structures 900X is also not limited to the number shown hereinand could be of an even or odd integer. Although not shown, in otherapplications, each paired common conductive cage-like structure 800Xsandwiches at least one conductive pathway electrode as previouslydescribed in relation to FIG. 3. The common conductive cage-likestructures 800X are shown separately to emphasize the fact they arepaired together and that any type of paired conductive pathways can beinserted within the respective common conductive cage like structures800X. As such, the common conductive cage-like structures 800X have auniversal application when paired together to create larger commonconductive cage-like structures 900X, which are delineated as 900B, 900Aand 900C, respectively and can be used in combination with pairedconductive pathways in discrete, or non-discrete configurations such as,but not limited to, embedded within silicone or as part of a PCB,discreet component networks, and the like.

The common conductive pathway electrodes 830, 810, 804/804-IM, 808, 840,are all conductively interconnected as shown at 802A and 802B(s) whichprovide connection point(s) to an external conductive area (not shown).Each common conductive pathway electrode 830, 810, 804/804-IM, 808, 840,is formed on dielectric material 801 to edge 805 and reveal oppositeside bands also comprised of dielectric material 801.

As has described in FIG. 3, the dielectric material 801, conductivelyseparates the individual common conductive pathway electrodes 830, 810,804/804-IM, 808, 840, from the conductive pathway electrodes (not shown)sandwiched therein. In addition, as described in relation to FIG. 3, aminimum of two cages, for example 800B and 800C, which make up largercage 900A, are required to make up a multi-functional line-conditioningstructure for use in all of the layered embodiments of the presentinvention. Accordingly, there are a minimum of two required commonconductive cage like structures 800X, as represented in FIG. 4 per each900A, 900B, and 900C, respectively. No matter the amount of shieldlayers used or the processes that derive the final form are arrived at,the very basic common conductive pathway manufacturing result of anysequence (excluding dielectric materials, etc.) should appear as anembodiment structure that is as follows: a first common conductivepathway, then a conductive pathway (not shown), then a second commonconductive pathway, second conductive pathway (not shown) and a thirdcommon conductive pathway. The second common conductive pathway in thepreceding results becomes the centrally positioned element of theresult. For additional layering of pathways desired, additional resultsof a manufacturing sequence would yield as follows for example, a thirdconductive pathway (not shown), than a fourth common conductive pathway,a fourth conductive pathway (not shown); than a fifth common conductivepathway. If an image shield configuration is desired to be used as isshown in FIG. 4 as pathways 850/850-IM and 860/860-IM there is nodifference in the first layer result other than a last set ofsandwiching common conductive pathways 850/850-IM and 860/860-IM areadded. Again as a result of almost any manufacturing sequence asfollows: (excluding dielectric material, etc.) 860/860-IM commonconductive pathway is placed, than a first common conductive pathway,then a conductive pathway (not shown), then a second common conductivepathway, second conductive pathway (not shown) and a third commonconductive pathway a third conductive pathway (not shown), than a fourthcommon conductive pathway, a fourth conductive pathway (not shown); thana fifth common conductive pathway, finally a 850/850-IM commonconductive pathway will be the resulting structure for this example inFIG. 4. In summary, most chip, non-hole thru embodiments of theapplicants discreet, non-interposer energy conditioners will have aminimum of two electrodes 809 and 809′ (not shown) sandwiched betweenthree common conductive electrodes 808 (not shown) and 804/804-IM and810 (not shown), respectively, and a minimum of two electrodes 809 and809′ (not shown) connect to external structures 809A and 809A′ (notshown). Three common conductive electrodes 808 (not shown) and804/804-IM and 810 (not shown), respectively and connected externalstructures 802A and 802B are connected such that they are conductivelyconsidered as one to form a single, larger Faraday-cage-like structure900A. Thus when a single, larger Faraday-cage-like structure 900A isattached to a larger external conductive area (not shown), thecombination helps perform simultaneously, energized line conditioningand filtering functions upon the energy propagating along the conductors809 and 809′ (not shown), sandwiched within the cage-like structure900A, in an oppositely phased or charged manner. Connection of thejoined common conductive and enveloping, multiple common shield pathways808 (not shown) and 810 (not shown), respectively with a commoncentrally located common conductive pathway 804/804-IM will become likethe extension of external conductive element 6803, as shown in FIG. 5Band will be interposed in such a multiple parallel manner that saidcommon conductive elements will have microns of distance separation or‘loop area ’ with respect to the complimentary, phased differentialelectrodes that are sandwiched themselves and yet are separated from theextension of external conductive element like 6803, shown in FIG. 5B bya distance containing a dielectric medium.

This enables the extension of external conductive element like 6803,shown in FIG. 5B to perform electrostatic shielding functions, amongothers, that the energized combination as just described will enhanceand produce efficient, simultaneous conditioning upon the energypropagating on or along said portions of assembly 900A's differentialconductors 809 and 809″ (not shown). The internal and external parallelarrangement groupings of a combined common conductive 900A will alsocancel or suppress unwanted parasitics and electromagnetic emissionsthat can escape from or enter upon portions of said differentialconductors differential conductors 809 and 809′ (not shown) used by saidportions of energy as it propagates along a conductive pathways (notshown) to active assembly load(s), which is explained further, belowwith FIG. 5A.

Referring now to FIGS. 4A and 4B, a universal, multi-functional, commonconductive shield structure with feed-thru pathways (UMFCCSS-F) isdescribed. FIG. 4A shows the universal, multi-functional, commonconductive shield structure having four stacked, common conductivecage-like structure containers 800A, 800B, 800C, and 800D (each referredto generally as 800X), in a generally parallel relationship, aspreviously shown in FIG. 2A. Each common conductive cage like structure800X comprises at least two common conductive pathway electrodes 4810,4804, 4808, 4840, 4830. The common conductive pathway electrodes 4810,4804, 4808, 4840, 4830, each have terminations which are allconductively interconnected as shown at 802, which provides a connectionpoint to an external conductive area (not shown). Turning to FIG. 4B,four stacked, common conductive cage-like structure containers 800A,800B, 800C, and 800D each contain a conductive pathway electrode 4809A,4807A, 4809B, and 4807B, respectively. The conductive pathway electrodes4809A, 4809B are conductively connected in parallel by bands 4880A and4880B through the universal, multi-functional, common conductive shieldstructure in a feed-thru relationship. Bands 4880A and 4880B areconductively connected to energy pathways 4809A and 4809B from an energysource (not shown). Bands 4890A and 4890B are conductively connected toreturn energy pathways 4807A and 4807B from to an energy-utilizing load(not shown).

It can be seen from FIG. 4B that conductive pathway electrodes 4809A and4809B are interspersed with return conductive pathway electrodes 4807Aand 4807B. Relating back to FIG. 4A, shared common conductive pathwayelectrodes 4810, 4804, 4808 can be seen between common conductive cagelike structure containers 800A, 800B, 800C, and 800 D, each sandwichedin FIG. 4B between at least two electrodes, 4809A and 4807A, 4807A and4809B and 4809B and 4807B, respectively. This enables the universal,multi-functional, common conductive shield structure to operate in abalanced manner. It is also pointed out that the central commonconductive shared pathway electrode 4804 is centrally positioned havingone conductive pathway electrode 4807A and one conductive pathwayelectrode 4809B on each side. Therefore, central common conductiveshared pathway electrode 4804 not only provides a balance betweenadjacent conductive pathway electrodes 4807A, 4809B, but also betweenall conductive pathway electrodes as the center 813 of the area ofconvergence.

Referring now to FIGS. 4C and 4D, a universal, multi-functional, commonconductive shield structure with Bypass pathways (UMFCCSS-B) isdescribed. FIG. 4C again shows the universal, multi-functional, commonconductive shield structure having four stacked, common conductivecage-like structure containers 800A, 800B, 800C, and 800D (each referredto generally as 800X), in a generally parallel relationship, aspreviously shown in FIG. 2A. Each common conductive cage like structure800X comprises at least two common conductive pathway electrodes 4810,4804, 4808, 4840, 4830. The common conductive pathway electrodes 4810,4804, 4808, 4840, 4830, each are all conductively interconnected asshown at 802, which provides a connection point to an externalconductive area (not shown). Turning to FIG. 4D, four stacked, commonconductive cage-like structure containers 800A, 800B, 800C, and 800Deach contain a conductive pathway electrode 4809C, 4807C, 4809D, and4807D, respectively. The conductive pathway electrodes 4809C, 4809D areconductively connected in parallel by band 4880C through the universal,multi-functional, common conductive shield structure in a by-passrelationship. Band 4880C is conductively connected to a power energypathway (not shown) from an energy power source (not shown). Band 4890Cis conductively connected to a return energy pathway (not shown) from toan energy-utilizing load (not shown). It can be seen from FIG. 4D thatthe power conductive pathway electrodes 4809C and 4809D are interspersedwith return conductive pathway electrodes 4807C and 4807D. Relating backto FIG. 4C, it can be seen that the shared common conductive pathwayelectrodes 4810, 4804, 4808 between common conductive cage likestructure containers 800A, 800B, 800C, and 800D, are each sandwiched inFIG. 4D between a power conductive pathway electrode and a returnconductive pathway electrode.

Referring now to FIGS. 5A and 5B, a further embodiment of the layered,universal, multi-functional common conductive shield structure of thepresent invention is shown in a by-pass configuration 6800 hereinafterreferred to as “by-pass shield structure”. By-pass shield structure 6800could also take on a configuration of ‘feed-thru shield structure” 6800in terms of relative stacking position of a static embodiment of each.There would be relatively no difference between these two possibleconfigurations when inspecting the positioning of stacked two commonconductive shield structures 1000A and 1000B or of common conductivepathways 6808, 6810, 6811, 6812 and central common shared conductivepathway 6804 that could make up each embodiment. While appearingphysically similar in arrangement “feed-thru shield structure” 6800 and‘by-pass shield structure” 6800, each would still yield the samepossible functional contribution to the energy conditioning of acircuit. However, the way to which the non-common pathways 6809 and 6807are constructed and subsequently positioned with respect to circuitpathway attachments would also determine the final type of energyconditioning results that could be expected in the circuit. Whateverconfiguration, the various shielding functions, physical and electrical,work about the same way with respect to propagated energy (not shown) inthe AOC of By-pass shield structure 6800.

Referring specifically to FIG. 5A, the by-pass shield structure 6800 isshown in cross section extending longitudinally and comprises a sevenlayer common conductive pathway stacking of two common conductive shieldstructures 1000A and 1000B, which form the present embodiment of theby-pass shield structure 6800. In FIG. 5B, the by-pass shield structure6800 is shown in cross section perpendicular to the cross section shownin FIG. 5A.

Referring to both FIGS. 5A and 5B, the by-pass shield structure 6800comprises a central common conductive shared pathway 6804 that isconnected with elements 6808, 6810, 6811, 6812 and energized and willform a zero voltage reference to circuitry (not shown) with the creationof 6804-IM, 6811-IM and 6812-IM which is formed and relative only to theactive circuit elements attached commonly (not shown), but not beforeconnection of the 6802A and 6802B (s) by connection means 6805 toexternal conductive surface 6803. With energization, the circuitry (notshown) will include a passively operating universal, multi-functional,common conductive shield structure 6800 that will be used by energysource (not shown) and energy-utilizing load (s) with propagated energyin a balanced manner that will be available when energized activecomponents (not shown) in said circuitry (not shown) demand portions ofsaid energy. Elements as just described including portions of all of thecommon conductive elements in the chain of connections to 6803 as justdescribed will have created for said energized circuit elements 6807,6820, 6809, 6821, a zero voltage reference, 6811-IM, 6804-IM, 6812-IMrespectively, and with central common conductive shared pathway 6804,electrically balance coupled energy within the circuit (not shown) withthe formation of a third but common electrical node, separate of the twodistinct and separate differential nodes utilized by differentialconductive pathways 6809 and 6807 and their respective conductivelylinking elements 6820 and 6821.

In order to couple by-pass shield structure 6800 to an energizedcircuit, differential conductive pathways 6807 and 6809, respectively,are each inserted into one of the two common conductive shieldstructures. The first common conductive shield structure 1000A is formedbetween common conductive pathway 6810 and central common conductiveshared pathway 6804. The second common conductive shield structure 1000Bis formed between common conductive pathway 6808 and central commonconductive-shared pathway 6804. To use by-pass shield structure 6800 afirst differential conductive pathway 6807 is placed within the firstcommon conductive shield structure and separated from the commonconductive pathway 6810 and the central common conductive-shared pathway6804 by a dielectric material 6801. The dielectric material 6801separates and electrically isolates the first differential conductivepathway 6807 from the first common conductive shield structure. Inaddition, a second differential conductive pathway 6809 is placed withinthe second common conductive shield structure and separated from thecommon conductive pathway 6808 and the central common conductive-sharedpathway 6804 by a dielectric material 6801.

The first and second differential conductive pathways 6807 and 6809,respectively, are then electrically connected to external conductiveenergy pathways 6820 and 6821, respectively. The electrical connectionscan be made by any means known to a person of ordinary skill in the art,including but not limited to solder, resistive fit sockets, andconductive adhesives. Completing the by-pass shield structure 6800 arethe additional outer shield structures 6811 and 6812, which sandwichboth common conductive shield structures 1000A and 1000B with dielectricmaterial 6801 interposed between. Each of the outer common conductiveshields 6811 and 6812 form image structures 6811-IM and 6812-IM as justdescribed, when energized, that includes an outer conductive portion ofshields 6811 and 6812 (not shown) and the outer conductive portions ofexternal common conductive electrode structure(s) 6802A and 6802B thatforms a relatively large skin area and a zero voltage reference with6804-IM by external common conductive structure 6803. The outer skinsurface formed by the combination of the external common conductiveelectrode structure 6802A and 6802B and the outer shield imagestructures 6811-M and 6812-M absorbs energy when the circuit isenergized and than act as an additional enveloping shield structure withrespect to 6809 and 6807 differential conductive pathways. If theby-pass shield structure 6800 is attached to an external commonconductive pathway 6803 of an energy conditioning circuit assembly(‘ECCA’) by known means 6805, such as solder material, portions ofenergy will travel along the created low impedance pathway that existsinternally, with common conductive structure elements 6812, 6808, 6804,6810, 68116802A and 6802B, and the external connection 6805 to thirdconductive pathway 6803 and be able to return by this pathway 6803 toits source.

The external common conductive electrode structure(s) 6802A and 6802Bare connected to electrical circuits by means known in the art andtherefore the present invention is not limited to discreet structuresbut could, for example, be formed in silicon within an integratedcircuit. In operation, by-pass shield structure 6800 and the two commonconductive shield structures 1000A and 1000B, effectively enlarge thezero voltage reference 6804-IM, 6811-IM and 6812-IM within the area ofconvergence AOC 6813. The AOC 6813 is the energy central balance pointof the circuit.

The result of the by-pass shield structure 6800 when energized within acircuit is increased physical shielding from externally generated andinternally propagating parasitics 6816 (represented by the double sidedarrows) as well as providing lower impedance paths generated along thecommon conductive pathway electrode 6812, 6808, 6804, 6810, 68116802Aand 6802B, surfaces to external conductive pathway 6803. Theelectrostatic functions (not shown) occur in an energized state toenergy parasitics 6816, which are also representative of portions ofexternally and internally originating energy parasitics 6816 that wouldotherwise disrupt portion of propagated energy. The double-sided arrowsshow the charged electron exchange representative of the electrostaticfunctions that occur in an energized state to trap parasitics 6816within a shielded container. The double-sided arrows also represent thesimultaneous, but opposite charge affect that occurs along the ‘skins’of the conductive material that is located within each respectivecontainer.

Turning now to FIG. 6A, a layering sequence of a surface mount energyconditioning interposer 30 with circuit architecture is shown.Interposer 30 comprises a minimum of two differential conductivepathways 303, 305. Interposer 30 also comprises a minimum of threecommon conductive pathway layers 302, 304, 306, which are electricallyinterconnected and surround the differential conductive pathways 303,305, both above and below, to form a large Faraday cage-like commonconductive shield structure about each paired differential pathways, ashas been previously disclosed. In one embodiment, interposer 30 alsocomprises an additional common conductive pathway layer 301/301-IM,307/307-IM, or image shield layer, stacked on the outer commonconductive pathway layers 302 and 306. These image shield layers301/301-IM, 307/307-IM are also electrically interconnected to the othercommon conductive pathway layers 302, 304, and 306. The centrallypositioned common conductive pathway 304 separates differentialconductive pathways 303, and 305. Common conductive pathway 304 isshared such that it forms a portion of a Faraday cage-like conductiveshield structure surrounding both the first and second differentialconductive pathways 303 and 305.

Each common conductive pathway layer 301/301-IM, 302, 304, 306,307/307-IM comprises a conductive electrode material 400 deposited in alayer surrounded on at least a portion of a perimeter thereof by aninsulation band 34. Insulation band 34 is made of a non-conductivematerial or dielectric material. Protruding through the insulation bands34 on the perimeter of each common conductive pathway layer 301/301-IM,302, 304, 306, 307/307-IM are electrode extensions 32, 35 whichfacilitate connections between the common conductive pathways and I/O ofvarious IC chips (not shown) in addition to other external connectionsto common conductive pathways or other shields. Similarly, first andsecond differential conductive layers 303, 305 comprise a conductiveelectrode material 400 deposited in a layer surrounded on at least aportion of a perimeter thereof by an insulation band 37 and 38,respectively. Insulation bands 37 and 38 are made of a non-conductivematerial, dielectric material, or even can be simply an absence ofconductive material on the same layer of material that the conductivematerial resides upon. It should be noted that insulation bands 37 and38 are generally wider than insulation band 34 of the common conductivepathway layers 301/301-IM, 302, 304, 306, 307/307-IM such that there isan overlap or extension of the common conductive pathway layers beyondthe edge of the first and second differential conductive pathways as hasbeen previously discussed. First and second differential conductivelayers 303, 305 include multiple location electrode extensions 36 and39, respectively, which facilitate connections to the internalintegrated circuit traces and loads in addition to connections to theexternal energy source and/or lead frame.

As with previous embodiments, the layers 301/301-IM, 302, 303, 304, 305,306, and 307/307-IM are stacked over top of each other and sandwiched ina parallel relationship with respect to each other. Each layer isseparated from the layer above and below by a dielectric material (notshown) to form energy conditioning interposer 30.

In FIG. 6B, an integrated circuit 380 is shown mounted in a carrier, inthe form of an IC or DSP package 310 configured with connected wire pinouts (not shown). As generally indicated at 300, an integrated circuitdie is placed within IC package 310 with one section removed and exposedfor viewing of the internal and external interconnections featuresdisplaying the finished energy conditioning interposer 30 of FIG. 6A.Interposer 30 includes electrode termination bands 320 and 321 to whichall of the common conductive pathways are coupled are connected togetherat their respective electrode extensions 32 and 35. These commonconductive electrode termination bands 320 and 321 can also be connectedto a metalized portion of the IC package 310 and used as a “0” voltagereference node or connected to the circuit for portions of energyleaving the interposer 30 to an external connection (not shown) thatserves as the low impedance pathway return. Interposer 30 also comprisesdifferential electrode termination bands 330 corresponding to the firstdifferential electrode 303 and termination bands 340 corresponding tothe second differential electrode 305. Differential electrodetermination bands 330 and 340 are utilized for receiving energy andprovide a connection point for connections to energy-utilizing internalloads 370 of the IC die 380. It should be noted for the sake ofdepiction herein that interposer 30 is normally physically larger thanthe active component or IC it is attached to and conditioning energyfor.

While there are many IC package pin-outs 350 located around the ICcarrier edge 392 for signal in return pathways, there is only onepin-out utilized for energy entry, designated at 391B, and only onepin-out utilized for energy return, designated at 391A. The IC package310 is designed such that multiple power entry points are reduced to onepair of power entry/return pins 391A and 391B which are connected to thedifferential electrode termination bands 340 and 330, respectively, bybond wires 393A, 393B or other conductive pathways, or conventionalinterconnects. The single power entry portal represented by pins 391Aand 391B and the proximity of the electrode termination bands 330 and340 of interposer 30 to the power entry portal reduces the noise thatcan enter or exit the integrated circuit and interfere with circuitryboth internal or external to the integrated circuit package 310. Theconnections are by standard means known in the art such as, but notlimited to, wire bond jump wires and the like and is determined by thefinal application needs of a user.

Turning to FIG. 7, and cross-sectional views of varied embodiments ofFIG. 7, which are FIG. 8A and FIG. 8B, the applicants will move freelybetween all three drawings explaining interposer 60/61's, functions andmakeup for the embodiments show herein.

In FIG. 7, interposer 60/61 is shown in this case a top view depictionand it is quickly noted that in most cases, but not all, the oppositesides view or appearance of interposer 60/61 is approximately the sameas is shown in FIG. 7 the top view.

In one embodiment of the present invention, referring now to FIG. 7,interposer 60/61 comprises vias 63, 64 and 65, which provide conductiveenergy propagation pathway interconnections through a plurality ofsubstrate layers within the body of interposer 60/61 encased in material6312 and surrounded by conductive material 6309. This embodimenttypically utilizes either a paired path or a three-path configuration.In a paired, or two path configuration, interposer 60/61 utilizes apaired two-way I/O circuit pathway using both VIAS 64 and VIAS 65 for INenergy propagation pathways, while using VIAS 66 for the OUT energypropagation pathways. Circuit reference nodes (not shown) could be foundand utilized inside or adjacent to the AOC of interposer 60/61 by aportion of internal conductive pathways (not shown) pre-determined bythe user for portions of propagating energy servicing the load or frominside the AOC, depending on exact connection circuitry outside theinterposer 60/61.

A three-way conductive pathway I/O configuration is preferred and usesVIAS 65 for IN energy propagation, VIAS 64 for OUT pathed energypropagation or energy return, and uses the center VIAS 66 as a separate,common energy propagation pathway and reference attachment. VIAS 66allow portions of energy propagating in either direction between anenergy-utilizing load (not shown) and an energy source (not shown) tomove to a low impedance energy pathway created within the AOC that canbe pathed along externally designated common conductive pathways orareas outside of the AOC that would provide or share voltage potentialfor the circuitry within the interposer's AOC. This low impedance energypathway, or area, is created as energy from external pathway circuitryis transferred through differential pathways 60C and 60D and continueson to external conductive pathways on either one or multiple sides ofinterposer 60/61. Portions of this energy propagating within the AOC ofinterposer 60/61 propagate to common conductive pathways 6200/6200-IM,6201, 6202, 6203 and 6204/6204-IM and VIAs 66, which interconnects thecommon conductive pathways within the AOC of 60 in this case and allowsthe energy to propagate along to external common conductive pathways.

Depending on usage, there are some embodiment variations of interposer61/60 not depicted in FIG. 8B and FIG. 8A, but are easily contemplatedby the applicants that would have an IC mounting side only, with vias64,65,66 configured to that shown in FIG. 7. Yet, depending on theexternal pathway connections that are to be made or utilized, a variantof interposer 60, an alternative invention interposer might onlycomprise one, two or three of the 64,65,66 conductive via groups withthe same or alternate couplings to the perpendicularly disposed internalhorizontal conductive pathways such as common pathways 6200/6200-IM,6201,6202, 6203 and 6204/6204-IM, 60C and 60D.

FIG. 8B shows the common conductive via pathways 66 penetratingcompletely through to the opposing side 6312, yet a simple 2 way pathwayconfiguration could utilize all 64 and 65 configured vias, (no via 66penetrating to the opposing side 6312, but coupling just to the commonpathways 6200/6200-IM, 6201,6202, 6203 and 6204/6204-IM, created) asjust energy input pathways, while using the side conductive pathway 6308created by the joining of common pathways 6200/6200-IM, 6201,6202, 6203and 6204/6204-IM at 6308 as a return energy path, passing through fromthe vias 66 located as shown in FIG. 7 and moving through the internalAOC of device 60 and finally propagating outside the internal AOC ofdevice 60 as portions of the energy return to its source by externallyattached conductive pathways (not shown) such as wire bondings made tomaterial 6308 or conductive attachment nodes (not shown). It should alsobe noted that dotted line 60E represents interposer embodiment 61 orsimilar boundary or demarcation line of its non-penetratingconfiguration of common conductive pathways 6200/6200-IM, 6201,6202,6203 and 6204/6204-IM that do not make a conductive attachment within to6309 located on 6312S portions of interposers 60 & 61 and make couplingconnections only to vias 66 as shown in FIG. 8A, and not to material6308 as is shown for common conductive pathway electrodes 6200/6200-IM,6201,6202, 6203 and 6204/6204-IM in FIG. 8B of interposer 60. Ininterposer 61 it must be emphasized that the common conductive pathwayelectrodes 6200/6200-IM, 6201,6202, 6203 and 6204/6204-IM do notpenetrate material dielectric or insulative 6209 and emerge out to 63125of this embodiment to join with conductive material 6309 that is appliedon interposer embodiment 60 as shown on FIG. 8B. However, these commonconductive pathway electrodes 6200/6200-IM, 6201,6202, 6203 and6204/6204-IM still extend closer to 6312-S than do the 60D and 60Cdifferential pathways as demarcated or delineated by dotted line 60F inFIG. 7. Because of this positioning of the differential and commonpathways to one another interposers of the new invention will partake inthe electrostatic shielding functions attributed to these types ofpathway configurations, many of which are similarly described in detailwithin this disclosure.

These various pathway configurations reveal the versatility of thedevice and the that while the common conductive pathways 6200/6200-IM,6201,6202, 6203 and 6204/6204-IM appear to have a limited positioningcriteria, it must be noted that pathway vias 64,65,66 are much moreflexible and versatile in positioning configurations, shape, sizes, andcan be utilized to provide all sorts of energy conditioning functionsand pathway configurations as one in the art or not can dream up.Interposer 60/61 is configured in a way that uses a multi-aperture,multilayer energy conditioning pathway sets and substrate embodiment ina substrate format for conditioning propagating energy along pathwaysservicing an active element such as, but not limited to, an integratedcircuit chip or chips. Interposer 60/61 conditions propagating energy byutilizing a combined energy conditioning methodology of conductivelyfilled apertures known in the art as VIAs, in combination with amulti-layer common conductive Faraday cage-like shielding technologywith partially enveloped differential conductive electrodes or pathways.Interconnection of the substrate to the IC and to a mounting structureis contemplated with either wire bonding interconnection, flip-chipball-grid array interconnections, micro Ball-grid interconnections,combinations thereof, or any other standard industry acceptedmethodologies.

As shown in FIGS. 7 and 8B, conductive material 6309 can be applied ordeposited on side 6312S of Interposer 60 and can be utilized as anauxiliary energy return pathway. At energization, common conductivepathways 6200/6200-IM, 6201, 6202, 6203, 6204/6204-IM, VIAs 66, allshown in FIG. 8B, will form a path of least impedance with respect tothe higher impedance pathways located along differential conductivepathways 60C and 60D as well as VIAS 65 or 64.

Thus, when energized, common conductive pathways 6200/6200-IM, 6201,6202, 6203, 6204/6204-IM, VIAs 66 all shown in FIG. 8B and FIG. 8A areutilized as the “0” Voltage circuit reference node (not shown) foundboth inside and outside the common conductive interposer energy pathwayconfigurations (not shown) as the interposer is electrically positionedin an energized circuit.

Interposer 60 is connected to an integrated circuit 4100 by commonlyaccepted industry connection methods. On one side of interposer 60, thevarious differentially conductive pathways including vias 65 areelectrically connected between the energy source (not shown) and a load(not shown) and the various differentially conductive pathways includingvias 64 are connected by common industry means between the energyutilizing load (not shown) and the energy source (not shown) on a returnpathway that includes conductive pathway vias 66 for portions ofpropagating energy. It is understood in the art that vias 65 and 64poses no polarity charge before hook-up that would prevent each fromchanging energy propagation functions such as from In put to an outputfunction as long as consistency in species hook up is maintained, onceinitiated on the device.

FIG. 8A shows interposer 61 taken from a cross sectional view “A” of amain embodiment of energy conditioning interposer taken from FIG. 7surrounded by non conductive exterior surface 6312. Interposer 61comprises conductive differential energy pathway electrode 60-C that iscoupled to conductive VIA pathway 64 and conductive differential energypathway electrode 60-D that is coupled to conductive VIA pathway 65,each as designated at 6205 by standard industry known means.Differential energy pathway 60-C and differential energy pathway 60-Dare separated from each other by central, shared, common conductiveenergy pathway 6202 and from the top and bottom of the interposer 61 bycommon conductive energy pathways 6200/6200-IM, 6201, and 6203,6204/6204-IM, respectively. The common conductive energy pathways6200/6200-IM, 6201, 6202, 6203, and 6204/6204-IM, are interconnected byconductive VIA pathway 66 as designated at 6308 by standard industryknown means. The outer most common conductive energy pathways6200/6200-IM and 6204/6204-IM act as image shield electrodes and arevertically spaced from their adjacent common conductive energy pathways6201, 6203, respectively, as designated by 4011. Conductive via pathways64, 65, and 66 are selectively isolated in a predetermined manner fromcommon conductive energy pathways and differential conductive pathwaysby a gap 6307 which is space filled with dielectric medium or isolativeor insulating material and can either be an actual deposited material orsimply a void of conductive material that would prevents coupling of thevarious conductive interposer pathways.

It should be noted that conductive via pathways 64, 65 passes throughthe various conductive and dielectric material and is selectivelycoupled to interposer 61's conductive differential energy pathwayelectrodes as needed by the user. VIAs 64 and 65 can be chosen toreceive energy input, either output or image pathway duties as neededwith via 66. Conductive VIA pathways 64, 65, and 66 are electricallyconnected to external elements as previously discussed. Theseconnections can be any industry-accepted type of connection. As shown inFIGS. 8A and 8B, a connection is made by applying adhesive or solderball flux 4005, or an industry accepted contact material the of the forconductive seating pad 63 for gravity or adhesive placement processingusing solder balls 4007 which is a eutectic-type solder ball or industrystandard equivalent.

Now turning to FIG. 8B, interposer 60 is shown identical to thatinterposer 61 shown in FIG. 8A except that common conductive edgetermination material 6309 extends along the sides of the interposer andsurrounds the perimeter thereof as shown previously in FIG. 7. Also notethat common conductive edge termination material 6309 is electricallyconnected to common conductive energy conditioning pathways6200/6200-IM, 6201, 6202, 6203 and 6204/6204-IM and not done in FIG. 8A.Interposer 60 is also shown connected to an integrated circuit die 4100.The integrated circuit die 4100 is also shown with protective globcoating or encapsulment material 6212 just above the die surface. Theenergy conditioning interposer 60 is also mounted on a substrate 8007 orsubstrates to which the IC assembly will be attached either by ballgrids 8009 and 8010 or by other means commonly used in the industry. TheIC package pins 8009 provide interconnection to a substrate or socketconnector containing signal and ground connections not necessarily goingto interposer pathways, while 8010 pathway connections although notshown, could connect to interposer pathways for energy propagation. Itshould be noted that 4011 is the predetermined layering used or pathwayspacing that is part of the invention consideration, universally. Theseinterconnections are only to offer that they can be varied as to anystandard industry means of connecting an IC package to a PCB, PCB cardand the like. In the cases of MCM or SCM interconnections, interposer 60or 61 can be directly attached to substrate circuitry with standardindustry methodologies.

In FIG. 9, a close up of a portion of FIG. 8A reveals some of the actualexternal interconnecting elements for the VIA structures 64,65,66. Itshould be noted that the internal conductive pathways are typical butthe coupling points are not shown herein. On-conductive material 6209 isalso called out. Conductive capture pad 63 is disposed on one side ofthe non-conductive portion 6312 of the interposer 61 around conductivepathway via 66, which comprises a small diameter shaped pathway ofconductive material 66A that is selectively coupled 6308 or non-coupled6307 by standard means known in the art, either after vias are createdeither by a laser or drilling process that leaves a void for fillingwith material 66′ during the manufacturing process or at the same timedeposit of 66′ is made that couples 6308 to common conductive pathways6200/6200-IM, 6201, 6202, 6203 and 6204/6204-IM as shown in FIG. 8A. Acapture pad 63 is also formed on the opposite side opening of thenon-conductive material 6312 of the interposer 61 that coincides withconductive pathway via 66 leading to conductive capture pad 63 which isalso deposited on the bottom of interposer 61. An adhesive solder ballflux an industry accepted contact material or primer 4005 is thenapplied and subsequently followed by application of conductive solderball 4007 of the type commonly found in the art.

It is important to note that the actual manufacturing process used tomake an invention embodiment 60 or 61 and subsequently attach it to anactive chip, chips or IC and than to a mounting substrate can beaccomplished in many ways. Rather FIG. 9 is an attempt to merelyoutline, in general terms, some of the many mounting procedures andconnection materials that can be used, added, removed or areinterchangeable and widely varied from manufacturer to manufacturer.Attachment materials and methodologies, overall for interposer inventiondescribed herein are not limited in any way. The critical nature ofinvention functionality, rather is simply determined more on the actualattachment arrangements made for the differently grouped, commonconductive pathways and the differential conductive pathways to theexternal conductive pathways respectively, located outside the AOC thatare key elements so long as energy pathways are conductively nominal forenergy propagation.

Referring now to FIG. 10, the exterior, or underside of a prior art ICpackage is shown using an assembly of externally mounted, multiple lowinductance capacitive devices 8001 utilized in a prior art configurationwith the internally located prior art interposer. The IC packageexterior 8007 is a standard configuration where pin outs emerge from oneportion of the device for attachment to a mounting substrate, PCB ordaughter card assembly, while other energy pathways utilize eithercombinations of ball grid sockets 8006 and pin outs or simply sockets8006 while conductive pin-outs are used by other pathways such as signallines, for example or other standard means used in the industry. Ballgrid sockets 8004 are typically comprised for receipt of eutectic solderor the like and are typically configured around the inner region of theIC package 8002 rather than the exterior regions of 8007 to be closerfor energy delivery to the internally mounted active chip or IC (notshown). The ball grid sockets 8004 are located within a perimeter oroutline 8003 of the internal area location of the IC and interposerwithin the IC package 8007 as designated. Within the perimeter outline,ball grid sockets 8004 for interconnection are normally for energysupplying power by the I/O pathways 8005 of the IC package 8007. Thisprior art IC package is intended to show that the internally positionedprior art interposer (not shown) requires an assembly 8001 of lowinductance capacitive array chip device in location 8002 to functionproperly.

In contrast, referring now to FIG. 11, the exterior, or underside of anIC package 8007 is utilizing an embodiment of the present inventionmounted inside IC package 8007 as is shown, “ghosted” for ease ofdescription. As before, the perimeter outline 8003 designates thelocation of the IC and interposer 8006 within the IC package 8007 andthe perimeter is surrounded by ball grid sockets 8004. The mountedmulti-aperture energy conditioning architecture device 60-61 or similaris shown as a interposer located between the integrated circuit or ICassembly (not shown) and the mounting substrate or in this depiction themounting substrate used is the final layering or groups of layeringmaking up the outside portion of substrate package 8007. It should benoted that interposer 60-61 or similar can also be utilized to providefor an additional physical shielding function utilized by the active ICchip or chips connected to said interposer as well as it also providesthe simultaneous energy conditioning functions as described in thedisclosure. Shielding of this nature is accomplished by interposers merepresence in the package as long as the active chip (not shown) does nothave portions of its embodiment extending beyond the perimeter ofinterposer invention. Device 60 includes apertures 64 connected tointernal energy conditioning electrode(s) 60C and apertures 65 connectedto internal energy conditioning electrode(s) 60D. Conductive apertures66 are connected to common conductive pathways 6200/6200-IM, 6201, 6202,6203, and 6204/6204-IM or any additional pathways of the similar usethat are utilized.

FIG. 12 shows an alternative multi-component surface mount differentialand common mode filter which combines two individual filters into oneelectronic component. It should be understood that any number ofindividual filters can be incorporated into a single electroniccomponent and that the invention is not limited to two individualfilters. FIG. 12 a shows one interconnect arrangement with FIG. 12 bthrough 12 e disclosing the internal electrode and common groundconductive layers. First and second differential conductive bands 154and 156 are coupled to electrode plates 153 and 155 respectively andbands 154′ and 156′ are similarly coupled to electrode plates 153′ and155′. Multi-component surface mount filter 160 is also comprised ofmaterial 166 having predetermined electrical properties, as describedpreviously, disbursed in between the plurality of electrode and commonground conductive layers. Common ground conductive band 164 iselectrically connected to common ground conductive plate 163. Whatshould be noted is that not only does Applicant contemplate multiplecomponents within a single electronic package but that the shape andarrangement and/or length and width of first and second differentialconductive bands 154 and 156 and common conductive band 164 may bevaried to accompany any type of printed circuit board footprintdesirable. The conductive and common bands are only required to beelectrically coupled to the associated electrode plates and commonground conductive plate 163 while maintaining electrical isolation amongone another. The concept disclosed in FIG. 12 could just as easily beextended to incorporate 10, 20 or 100 differential and common modefilters if desired. Multi-component surface mount differential andcommon mode filter 160 is particularly useful for providing filtering tolarge data buses typically consisting of 32 or 64 data lines. These databuses handle digital information at extremely high frequencies emittinglarge amounts of electromagnetic energy and are also extremelysusceptible to over currents and voltage surges which can damagecircuitry and distort data.

It should be noted that in all embodiments, it is optional but preferredthat one set of outer common conductive pathways or layers designated as—IM should sandwich the entire stacking configuration, either placed inthe manufacturing process of the entire device, perhaps utilized frompart of the mounting substrate serving as a platform other than adiscrete IC package or the IC package itself or even by utilizing anexternal conductive pathway or larger external conductive area, alone orwith insulating material disposed between to take the place of at leastone of the two outer common conductive pathways designated —IM. Theprime set of outer common conductive pathways not designated as —IM andclosely positioned to the described set of outer are critical to thedevice as the common conductive pathways that form the basis of thesidelining electrode sandwich and can only be made optional in caseswhere the final shield is replaced or substituted with an externalconductive area that can fit most of the criteria described to allow theFaraday cage-like shield structure to maintain integrity with respect tothe energy conditioning functions desired. However in the case of the—IM designated shields they are optional yet desirable in that they willelectrically enhance circuit conditioning performance and further shiftoutward the new interposers' self resonate point and enhance thatportion of the circuit located within the AOC of the invention, as well.

It should be noted that if the common conductive container structuresthat make up an invention are in balance according to the result of thestacking sequence as described herein, any added or extra, single commonconductive shield layers designated —IM beyond the primary set of commonconductive pathways that are added by mistake or with forethought willnot degrade energy conditioning operations severely and this conditionin some cases can actually reveal a potential cost savings in themanufacturing process, wherein automated layering processes couldpossibly added one or more additional outer layer or layers as describedand where the application performance may not be as critical.

It is disclosed that these errors, intentional or accidental will notdetrimentally harm the balance of the invention containing the minimumproperly sequenced stacking of common conductive pathways as discussedand is fully contemplated by the applicants.

At least five or more, distinctly different energy conditioningfunctions that can occur within any variation of the invention;electrostatic minimization of energy parasitics by almost total shieldenvelopment; a physical shielding of portions of the differentialconductive pathways; an electromagnetic cancellation or minimizationshielding function or mutual magnetic flux cancellation or minimizationof opposing, closely positioned, differential conductive pathway pairs;utilization of a “0” voltage reference created by the central, commonand shared pathway electrode, the sandwiching outer first set of commonconductive pathways and any of the —IM designated pathways that areutilized as part of two distinct common conductive shield structurecontainers; a parallel propagation movement of portions of energyproviding a shielding effect as opposed to a series propagation movementof energy effect of the portions of energy located within the AOC. Aparallel propagation movement of portions of energy occurs whendifferentially phased energy portions operate in an opposing, yetharmonious fashion with said energies divide such that approximately ½half of the total energies or portions found at any onetime within theAOC of the invention will be located on one side of the central commonand shared conductive energy pathway in a electrical and/or magneticoperation utilizing its parallel, non-reinforcing counterpart thatoperates in a generally opposing cancellation or minimization-typemanner or in a manner that does not enhance or create detrimental forcesin a manner like that of the prior art which operates in a generallyseries-type manner despite the usage in a few cases of a mutual magneticflux cancellation or minimization technique of opposing differentialconductive pathway. Prior art due to its structure all but fails toutilize the simultaneous sandwiching electrostatic shielding functioninherent in the new invention as has been described in this disclosure.

In all embodiments whether shown or not, the number of pathways, bothcommon conductive pathway electrodes and differential conductive pathwayelectrodes, can be multiplied in a predetermined manner to create anumber of conductive pathway element combinations a generally physicalparallel relationship that also be considered electrically parallel inrelationship with respect to these elements in an energized existencewith respect to a circuit source will exist additionally in parallelwhich thereby add to create increased capacitance values.

Next, additional common conductive pathways surrounding the combinationof a center conductive pathway and a plurality of conductive electrodesare employed to provide an increased inherent common conductive pathwayand optimized Faraday cage-like function and surge dissipation area inall embodiments.

Fourth, although a minimum of one central common conductive shieldpaired with two additionally positioned and sandwiching commonconductive pathways or shields are generally desired and should bepositioned on opposite sides of the central common conductive shield(other elements such as dielectric material and differential conductiveelectrode pairs, each positioned on opposite sides of said centralcommon layer can be located between these shields as described).Additional common conductive pathways can be employed such as the —IMdesignated shields that do not have a differential conductive pathwayadjacent to its position with any of the embodiments shown and is fullycontemplated by Applicant.

Finally, from a review of the numerous embodiments it should be apparentthat the shape, thickness or size may be varied depending on theelectrical characteristics desired or upon the application in which thefilter is to be used due to the physical architecture derived from thearrangement of common conductive electrode pathways and their attachmentstructures that form at least one single conductively homogenous Faradaycage-like conductive shield structure with conductive electrodepathways.

Although the principals, preferred embodiments and preferred operationof the present invention have been described in detail herein, this isnot to be construed as being limited to the particular illustrativeforms disclosed. It will thus become apparent to those skilled in theart that various modifications of the preferred embodiments herein canbe made without departing from the spirit or scope of the invention asdefined by the appended claims.

1. A conductive pathway arrangement for an integrated circuit wafer,comprising: an integrated circuit wafer; a first conductive pathwayhaving a first area; a second conductive pathway having a second area,and wherein said second conductive pathway is connected to saidintegrated circuit wafer; a third conductive pathway having a thirdarea; a fourth conductive pathway having a fourth area, and wherein saidfourth conductive pathway is connected to said integrated circuit wafer;a fifth conductive pathway having a fifth area; a dielectric; whereinsaid dielectric spaces apart all said conductive pathways of saidconductive pathway arrangement from one another; wherein said firstconductive pathway, said third conductive pathway and said fifthconductive pathway are conductively connected to one another; whereinsaid second conductive pathway is conductively isolated from said firstconductive pathway; wherein said third area of said third conductivepathway is positioned between a first portion of said second area ofsaid second conductive pathway and a first portion of said fourth areaof said fourth conductive pathway; and wherein said first portion ofsaid second area of said second conductive pathway is aligned with saidfirst portion of said fourth area of said fourth conductive pathway. 2.The conductive pathway arrangement of claim 1, wherein said secondconductive pathway is conductively isolated from said fourth conductivepathway.
 3. The conductive pathway arrangement of claim 2, wherein saidfirst portion of said second area of said second conductive pathway isshielded from said first portion of said fourth area of said fourthconductive pathway by said third area of said third conductive pathway.4. The conductive pathway arrangement of claim 3, wherein said firstconductive pathway, said third conductive pathway and said fifthconductive pathway are connected to at least one conductive VIA.
 5. Theconductive pathway arrangement of claim 3, wherein said first conductivepathway is a first conductive feed-thru pathway, and wherein said secondconductive pathway is a second conductive feed-thru pathway; and whereinsaid conductive pathway arrangement is operable as an energyconditioning network when said conductive pathway arrangement isenergized.
 6. An energized conductive pathway arrangement of claim
 5. 7.An energized conductive pathway arrangement of claim 4, wherein saidsecond conductive pathway is a first differential feed-thru pathway, andwherein said fourth conductive pathway is a second differentialfeed-thru pathway, and wherein at least said first portion of saidsecond area of said first differential feed-thru pathway and said firstportion of said fourth area of said second differential feed-thrupathway operate together to modify an electrical transmission of energy.8. The conductive pathway arrangement of claim 4, wherein said firstportion of said second area of said second conductive pathway issubstantially the same size as said first portion of said fourth area ofsaid fourth conductive pathway.
 9. An energized conductive pathwayarrangement of claim 3, wherein said third area of said third conductivepathway sustains a first voltage for a first energy propagating saidfirst portion of said second area of said second conductive pathway; andwherein said third area of said third conductive pathway sustains saidfirst voltage for a second energy propagating said first portion of saidfourth area of said fourth conductive pathway.
 10. An electrodearrangement comprising: a first differential electrode and a seconddifferential electrode, and wherein said differential electrodes areelectrically isolated from each other; a first common electrode, asecond common electrode and a third common electrode, and wherein saidcommon electrodes are conductively connected to one another; whereinsaid common electrodes are electrically isolated from said differentialelectrodes; wherein a portion of said second common electrode is betweena portion of said first differential electrode and a portion of saidsecond differential electrode, and wherein said portion of said firstdifferential electrode, said portion of said second common electrode andsaid portion of said second differential electrode are between a portionof said first common electrode and a portion of said third commonelectrode, and wherein any said portion of said common electrodes andany said portion of said differential electrodes are substantiallyparallel with one another; wherein a first area of said portion of saidsecond common electrode is larger than an area of said portion of saidfirst differential electrode, and wherein a second area of said portionof said second common electrode is larger than an area of said portionof said second differential electrode; wherein said area of said portionof said first differential electrode is in an alignment with said areaof said portion of said second differential electrode, and wherein saidarea of said portion of said first differential electrode overlaps saidarea of said portion of said second differential electrode; wherein saidarea of said portion of said first differential electrode and said areaof said portion of said second differential electrode are simultaneouslyshielded from each other by said first area of said portion of saidsecond common electrode and said second area of said portion of saidsecond common electrode; and wherein said area of said portion of saidfirst differential electrode and said area of said portion of saidsecond differential electrode are simultaneously shielded by saidportion of said first common electrode and said portion of said thirdcommon electrode.
 11. The electrode arrangement of claim 10, furthercomprising: an integrated circuit die; and wherein said firstdifferential electrode is conductively connected to a first part of saidintegrated circuit die, and wherein said second differential electrodeis conductively connected to a second part of said integrated circuitdie.
 12. The electrode arrangement of claim 11, wherein said first areaof said portion of said second common electrode is substantially thesame size as said second area of said portion of said second commonelectrode.
 13. The electrode arrangement of claim 11, wherein eachcommon electrode of said common electrodes is larger than any onedifferential electrode of said differential electrodes.
 14. An energizedelectrode arrangement of claim 12, further comprising: a firstcapacitance having a first capacitive value, wherein said firstcapacitance is operable between said area of said portion of said firstdifferential electrode and said first area of said portion of saidsecond common electrode; a second capacitance having a secondcapacitance value, wherein said second capacitance is operable betweensaid area of said portion of said second differential electrode and saidsecond area of said portion of said second common electrode; a thirdcapacitance having a third capacitance value, and wherein said thirdcapacitance is operable between said area of said portion of said firstdifferential electrode and said area of said portion of said seconddifferential electrode; and wherein said third capacitance value issubstantially half of said first capacitance value.
 15. The electrodearrangement of claim 12, wherein said arrangement is operable as anenergy conditioning network when said electrode arrangement isenergized.
 16. The electrode arrangement of claim 13, wherein saidcommon electrodes provide simultaneous electrostatic shielding of saidarea of said portion of said first differential electrode and said areaof said portion of said second differential electrode when saidelectrode arrangement is energized.
 17. A substrate arrangement for anintegrated circuit die, comprising: a substrate having at least a firstand a second substrate surface, and wherein said first substrate surfaceand said second substrate surface are parallel with each other; a firstcommon electrode having a first common electrode layered portion; afirst electrode having a first electrode layered portion; a secondcommon electrode having a second common electrode layered portion; asecond electrode having a second electrode layered portion; a thirdcommon electrode having a third common electrode layered portion;wherein said first common electrode is electrically isolated from saidfirst electrode and said second electrode, and wherein said firstelectrode and said second electrode are electrically isolated from eachother; wherein an area of said second common electrode layered portionis between an area of said first electrode layered portion and an areaof said second electrode layered portion, and wherein said area of saidfirst electrode layered portion, said area of said second commonelectrode layered portion, and said area of said second electrodelayered portion are between an area of said first common electrodelayered portion and an area of said third common electrode layeredportion, and wherein said area of said first common electrode layeredportion, said area of said first electrode layered portion, said area ofsaid second common electrode layered portion, said area of said secondelectrode layered portion, and said area of said third common electrodelayered portion are between said first substrate surface and said secondsubstrate surface; wherein said area of said first common electrodelayered portion is larger than said area of said first electrode layeredportion, and wherein said area of said second common electrode layeredportion is larger than said area of said first electrode layeredportion, and wherein said area of said third common electrode layeredportion is larger than said area of said first electrode layeredportion; and wherein said area of said first electrode layered portionis shielded from said area of said second electrode layered portion bysaid area of said second common electrode layered portion.
 18. Thesubstrate arrangement of claim 17, further comprising: an integratedcircuit die connected to said first substrate surface; wherein saidfirst electrode is conductively connected to said integrated circuitdie; wherein said second electrode is conductively connected to saidintegrated circuit die; and wherein said three common electrodes areconductively connected to one another.
 19. The substrate arrangement ofclaim 18, wherein said area of said first common electrode layeredportion is larger than said area of said second electrode layeredportion, and wherein said area of said second common electrode layeredportion is larger than said area of said second electrode layeredportion, and wherein said area of said third common electrode layeredportion is larger than said area of said second electrode layeredportion.
 20. An energized substrate arrangement of claim 19, whereinsaid first electrode and said second electrode are each operable in afeed-thru configuration; and wherein at least all of said areas of allsaid layered portions are operable together as one differential mode andcommon mode energy filter.